5SGXEB5R2F43C2

The 5SGXEB5R2F43C2 is a Stratix® V GX family field programmable gate array (FPGA) in a 1760-ball FCBGA package designed for high-density, high-connectivity designs. It combines a large logic fabric with substantial on-chip memory and a high I/O count to address complex digital signal processing, prototyping, and system integration tasks.

With 490,000 logic elements, approximately 42 Mbits of embedded memory, and support for Stratix V GX device transceiver options (see device documentation for speed grades), this device targets applications that require significant programmable logic, dense external interfacing, and low-voltage core operation.

Key Features

• Core / Logic 490,000 logic elements provide extensive programmable logic resources for large designs and complex algorithm implementation.
• Embedded Memory Approximately 42 Mbits of on-chip RAM (41,984,000 bits) for large buffering, lookup tables, and state storage without external memory.
• I/O & Connectivity 600 general-purpose I/O pins enable dense peripheral and board-level interfacing for multi-channel systems and high-pin-count designs.
• Power Core voltage supply range of 870 mV to 930 mV to match low-voltage system power domains.
• Package & Mounting 1760-ball FCBGA package (1760-FCBGA, 42.5 × 42.5 mm) in a surface-mount form factor for high-density board integration and thermal management.
• Temperature & Grade Commercial grade operation with an ambient range of 0 °C to 85 °C for standard commercial applications.
• Regulatory RoHS compliant.

Typical Applications

• High‑performance Prototyping Large logic capacity and substantial on-chip RAM make this FPGA suitable for complex prototype systems and hardware emulation.
• Communications & Networking High I/O count supports multi‑lane interfaces and dense front‑end connectivity for network processing and protocol handling; Stratix V GX family transceiver options support high-speed link configurations per device documentation.
• Signal Processing Large logic and memory resources support DSP pipelines, video/graphics preprocessing, and data aggregation tasks.
• System Integration The 1760-FCBGA package and surface-mount mounting simplify integration into compact, high-density system boards.

Unique Advantages

• High Logic Density: 490,000 logic elements allow consolidation of large functions on a single device, reducing board-level complexity.
• Substantial Embedded Memory: Approximately 42 Mbits of on-chip RAM minimizes dependence on external memory for buffering and state retention.
• Extensive I/O Resources: 600 I/Os enable direct connection to multiple peripherals, interfaces, and mezzanine cards without complex routing compromises.
• Low‑Voltage Core Operation: 870–930 mV supply range aligns with low-voltage power architectures to support power-optimized system designs.
• Commercial Temperature Rating: Designed for standard commercial environments (0 °C to 85 °C), suitable for a wide range of consumer and enterprise applications.
• RoHS Compliant: Meets common environmental regulatory requirements for easier product acceptance and manufacturing.

Why Choose 5SGXEB5R2F43C2?

The 5SGXEB5R2F43C2 brings together a high-density Stratix V GX architecture, very large on-chip memory, and a 600-pin I/O envelope in a single 1760-FCBGA package. It is suited to designers who need to implement complex digital systems with significant internal storage and dense external connectivity while operating within commercial temperature ranges and low-voltage power domains.

For teams building high-performance prototypes, communications infrastructure, or advanced signal-processing modules, this device offers a scalable, integrated platform with the documented capabilities of the Stratix V GX family and the capacity to consolidate multiple functions onto a single FPGA to simplify BOM and board layout.

Request a quote or submit an RFQ to receive pricing, availability, and ordering information for the 5SGXEB5R2F43C2.