5SGXEB5R2F43C2LG

The 5SGXEB5R2F43C2LG is a Stratix® V GX Field Programmable Gate Array (FPGA) supplied in a high-pin-count 1760-ball FCBGA/BBGA package. It delivers substantial programmable logic capacity, abundant I/O, and multi-megabit embedded RAM for demanding commercial applications.

Designed for designs that require large logic arrays, extensive I/O connectivity, and on-chip memory, this device targets high-density digital systems where integration and predictable electrical characteristics matter.

Key Features

• Core Logic  490,000 logic elements provide significant programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM to support buffering, packet processing, or large internal state storage.
• I/O Density  600 user I/Os enable high-pin-count board designs and broad interfacing options with external peripherals and systems.
• Power  Core supply specified at 0.82 V to 0.88 V, supporting low-voltage core operation as defined for the device.
• Package and Mounting  Available in a 1760-FCBGA (42.5 mm × 42.5 mm) / 1760-BBGA package and intended for surface-mount assembly.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Large logic capacity and extensive on-chip RAM support complex processing pipelines and programmable acceleration.
• High-pin-count system I/O  600 I/Os enable dense board-level connectivity for communication, control, and multi-interface platforms.
• Embedded memory–intensive designs  Approximately 42 Mbits of embedded RAM enable large buffers, FIFOs, and state storage without immediate external memory.

Unique Advantages

• High programmable capacity: 490,000 logic elements allow consolidation of large functions into a single device, reducing inter-component complexity.
• Substantial on-chip RAM: Approximately 42 Mbits of embedded memory reduces dependence on external memory for many buffering and state-storage tasks.
• Extensive I/O: 600 user I/Os provide design flexibility for connecting multiple peripherals, high-speed interfaces, or parallel buses.
• Compact, high-density package: 1760-FCBGA (42.5 mm × 42.5 mm) packaging supports high pin-count routing while remaining compatible with surface-mount assembly practices.
• Commercial temperature grading: Rated 0 °C to 85 °C to match a wide range of commercial electronics deployments.
• RoHS compliant: Meets environmental compliance requirements for lead-free assembly.

Why Choose 5SGXEB5R2F43C2LG?

The 5SGXEB5R2F43C2LG positions itself as a high-density, high-I/O Stratix V GX FPGA suitable for commercial applications that require large logic resources, substantial on-chip memory, and numerous I/Os in a single-package solution. Its low-voltage core specification and commercial temperature rating make it suitable for mainstream embedded and board-level designs.

For design teams seeking a device with strong integration potential and clear electrical specifications, this Stratix V GX part provides a verifiable platform with extensive documented device-level characteristics in its Stratix V series datasheet.

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