5SGXEB5R2F43C3G

The 5SGXEB5R2F43C3G is a Stratix V GX field programmable gate array (FPGA) from Intel, built for high-density logic integration. It provides 490,000 logic elements and approximately 42 Mbits of embedded memory, delivering substantial on-chip capacity for complex programmable designs.

Packaged in a 1760-FCBGA (42.5×42.5 mm) surface-mount package with up to 600 I/O, this commercial-grade device operates over a 0 °C to 85 °C temperature range and requires a core supply in the 820 mV to 880 mV range. The device is RoHS compliant and is covered by the Stratix V device datasheet for detailed electrical and switching characteristics.

Key Features

• Logic Capacity  490,000 logic elements for high-density programmable logic implementations.
• Embedded Memory  Approximately 42 Mbits of total on-chip RAM bits to support large buffering, FIFOs, and state storage.
• I/O Count  Up to 600 I/O pins to support wide external interfaces and multi-channel designs.
• Package & Mounting  1760-FCBGA (1760-BBGA) surface-mount package, 42.5×42.5 mm, optimized for high-pin-count board designs.
• Core Voltage  Rated core supply from 820 mV to 880 mV to match targeted power domains.
• Commercial Temperature Grade  Specified for operation from 0 °C to 85 °C for commercial applications.
• Regulatory  RoHS compliant.

Typical Applications

• High-density programmable logic systems  Architectures that require large logic capacity and flexible logic partitioning enabled by 490,000 logic elements.
• Memory-intensive designs  Systems needing substantial on-chip RAM (≈42 Mbits) for buffers, packet queues, or embedded data stores.
• High I/O-count platforms  Board-level designs that demand extensive external connectivity with up to 600 I/O pins.
• Compact, high-pin-count deployments  Applications leveraging the 1760-FCBGA package to consolidate functionality in a single surface-mount FPGA.

Unique Advantages

• Large integrated logic  490,000 logic elements reduce the need for multiple devices in complex designs, simplifying board-level integration.
• Substantial on-chip RAM  Approximately 42 Mbits of embedded memory supports larger data buffers and state machines without external memory.
• Extensive I/O  600 I/O pins enable broad interfacing capability for multi-channel and high-bandwidth external connectivity.
• Compact FCBGA footprint  1760-FCBGA (42.5×42.5 mm) provides a high pin-count solution in a single surface-mount package.
• Commercial temperature suitability  Rated for 0 °C to 85 °C to meet standard commercial deployment requirements.
• Regulatory compliance  RoHS compliant for streamlined environmental and manufacturing requirements.

Why Choose 5SGXEB5R2F43C3G?

This Stratix V GX FPGA delivers a balanced combination of high logic density, significant embedded memory, and a large I/O count in a single 1760-FCBGA surface-mount package. It is positioned for commercial designs that need consolidated programmable logic and memory capacity while preserving board real estate and connector count.

Engineers selecting the 5SGXEB5R2F43C3G benefit from documented Stratix V electrical and switching characteristics and a device suited to designs that require a high-density, commercially rated FPGA solution with defined core voltage and temperature operating ranges.

Request a quote or submit a sales inquiry to obtain pricing, availability, and further technical information for the 5SGXEB5R2F43C3G.