5SGXEB5R2F43C3N

The 5SGXEB5R2F43C3N is an Intel Stratix V GX field programmable gate array (FPGA) in a 1760‑FBGA (FCBGA) package. It delivers a large programmable fabric with 490,000 logic elements and approximately 42 Mbits of on‑chip RAM, combined with a high I/O count for complex system integration.

This commercial‑grade device (0 °C to 85 °C) is suited to designs that require substantial logic capacity, dense I/O, and significant embedded memory while operating from a core supply voltage between 820 mV and 880 mV. The device is RoHS‑compliant.

Key Features

• Logic Capacity – 490,000 logic elements to implement large-scale digital designs and complex state machines.
• Embedded Memory – Approximately 42 Mbits of on‑chip RAM for buffering, packet storage, or algorithmic working memory.
• I/O Density – Up to 600 I/Os to support wide parallel interfaces, multi‑lane connectivity, and high pin‑count peripherals.
• Package – 1760‑FCBGA package (1760‑FBGA, 42.5×42.5 mm) for high‑density board integration.
• Power Supply – Core voltage range of 820 mV to 880 mV to match system power rails and regulator designs.
• Commercial Grade Temperature – Rated for 0 °C to 85 °C operating temperature for standard commercial applications.
• Regulatory Compliance – RoHS‑compliant construction for environmental and manufacturing compatibility.

Typical Applications

• Network and Communications Modules – High logic count and large embedded memory enable packet processing, protocol bridging, and data buffering in communications equipment.
• High‑Performance Prototyping – Dense logic resources and extensive I/O support hardware emulation and prototype platforms for complex ASIC/SoC development.
• Accelerators and DSP Systems – Significant on‑chip RAM and programmable fabric capacity for dataflow engines, custom accelerators, and signal processing pipelines.
• Multi‑Interface Gateways – Large I/O complement supports aggregation of parallel interfaces, sensor arrays, and peripheral buses in gateway and controller designs.

Unique Advantages

• Substantial Logic Resources: 490,000 logic elements provide the headroom to implement complex control, compute, and datapath functions without partitioning across multiple devices.
• Ample On‑Chip Memory: Approximately 42 Mbits of embedded RAM reduces external memory dependencies and simplifies board routing for latency‑sensitive designs.
• High I/O Count: 600 I/Os enable direct interfacing to numerous peripherals and wide buses, reducing the need for external multiplexing logic.
• Compact, High‑Density Package: The 1760‑FCBGA (42.5×42.5 mm) package consolidates capacity into a single footprint for space‑constrained boards.
• Commercial Temperature Rating: Designed for standard commercial environments (0 °C to 85 °C), matching many enterprise and industrial control deployments.
• RoHS Compliance: Environmentally compliant manufacturing simplifies procurement and regulatory handling.

Why Choose 5SGXEB5R2F43C3N?

This Intel Stratix V GX FPGA combines high logic density, substantial embedded RAM, and a large I/O complement in a single 1760‑FCBGA package, making it well suited for complex digital designs that require integrated memory and extensive interfacing. Its commercial temperature rating and RoHS compliance support mainstream electronics production while the specified core voltage range allows integration with modern power architectures.

Choose this device when your design requires consolidated programmable logic capacity, significant on‑chip memory, and broad connectivity in a single FPGA package—reducing board complexity and enabling compact, high‑functionality systems.

Request a quote or submit a procurement request today to evaluate 5SGXEB5R2F43C3N for your next high‑capacity FPGA design.