5SGXEB5R2F43I2L

The 5SGXEB5R2F43I2L is an industrial-grade Stratix® V GX field programmable gate array (FPGA) by Intel. It provides extremely high logic density and a large I/O count in a 1760-ball FCBGA package for demanding embedded and industrial applications.

Designed for high‑capacity programmable logic implementations, this device combines approximately 42 Mbits of on-chip RAM with 490,000 logic elements and up to 600 I/O pins, offering the resources required for complex signal processing, protocol handling, and system integration tasks.

Key Features

• Core Logic Density  490,000 logic elements and approximately 185,000 logic blocks provide substantial capacity for large FPGA designs and complex custom logic implementations.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM to support frame buffers, FIFOs, and memory-heavy algorithms without external memory dependence.
• I/O  Up to 600 general-purpose I/O pins enable broad system connectivity and integration with peripherals, sensors, and high‑pin-count interfaces.
• Package  1760-ball FCBGA (42.5 × 42.5 mm) surface-mount package suitable for high-density PCB designs and robust mechanical integration.
• Power  Core voltage supply range specified at 820 mV to 880 mV for the device core domain.
• Temperature Range  Industrial operating range from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance  RoHS compliant for environmental and regulatory compatibility.

Typical Applications

• Industrial Control  Industrial systems benefit from the device’s industrial temperature rating, high I/O count, and large logic capacity for real-time control, motor drives, and automation tasks.
• High‑Density Signal Processing  Large logic element count and substantial on-chip RAM support complex DSP pipelines, packet buffering, and algorithm acceleration.
• Communications and Networking  High I/O capacity and Stratix V GX family heritage enable implementation of protocol engines, media gateways, and interface bridging in telecom and networking equipment.

Unique Advantages

• High logic capacity: 490,000 logic elements provide headroom for extensive custom logic, enabling consolidation of multiple functions into a single device.
• Significant on‑chip RAM: Approximately 42 Mbits of embedded memory reduces dependence on external RAM for buffering and state storage, simplifying board design.
• Large I/O complement: 600 I/O pins allow direct interfacing to a wide range of peripherals and parallel interfaces, minimizing the need for additional I/O expanders.
• Industrial robustness: −40 °C to 100 °C operating range and RoHS compliance make the device suitable for rugged industrial deployments.
• Compact, manufacturable package: 1760-FCBGA surface-mount form factor (42.5 × 42.5 mm) balances I/O density with PCB layout efficiency for production designs.
• Precise core power window: Defined core supply range (820 mV–880 mV) supports predictable power provisioning and thermal planning.

Why Choose 5SGXEB5R2F43I2L?

The 5SGXEB5R2F43I2L targets projects that require very high programmable logic density, substantial embedded memory, and broad I/O integration within an industrial temperature envelope. Its specification set—large logic element count, approximately 42 Mbits of on-chip RAM, 600 I/O pins, and a robust FCBGA package—makes it well suited for designers consolidating complex system functions into a single FPGA.

For engineering teams building industrial and embedded systems where reliability, integration, and scalability matter, this Stratix V GX device delivers the resources to implement advanced signal processing, protocol handling, and system control while simplifying board-level design and BOM.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXEB5R2F43I2L.