5SGXEB5R2F43I3

The 5SGXEB5R2F43I3 is an Intel Stratix V GX series FPGA providing large-scale programmable logic and substantial on‑chip memory for demanding industrial designs. This surface‑mount, industrial‑grade device combines 490,000 logic elements with approximately 42 Mbits of embedded RAM and 600 user I/O pins to support complex, high‑density FPGA implementations.

Designed for applications that require high integration density, extensive I/O and robust operating range, the device delivers a balance of logic capacity, memory and connectivity in a 1760‑FCBGA package (42.5 × 42.5 mm).

Key Features

• Core Logic  490,000 logic elements provide large programmable fabric for complex state machines, datapaths and custom accelerators.
• Embedded Memory  Approximately 42 Mbits of on‑chip RAM to support buffering, lookup tables and embedded data storage without external memory.
• I/O and Packaging  600 user I/O pins in a 1760‑BBGA/1760‑FCBGA (42.5 × 42.5 mm) package, suitable for high‑pin‑count system integration; surface‑mount mounting type.
• Power and Core Supply  Core voltage operating range specified from 820 mV to 880 mV for the programmable fabric.
• Temperature & Grade  Industrial temperature grade with specified operating range from −40 °C to 100 °C for deployment in industrial environments.
• Compliance  RoHS‑compliant manufacturing.

Typical Applications

• High‑density signal processing  Large logic capacity and abundant on‑chip RAM enable implementation of complex DSP chains and custom datapaths.
• Telecommunications & networking  Extensive I/O and high logic integration support packet processing, protocol offload and FPGA‑based network appliances.
• System prototyping and integration  High pin count and significant embedded memory make the device suitable for consolidating multiple functions into a single FPGA during system prototyping or integration.

Unique Advantages

• High programmable density: 490,000 logic elements enable large, complex logic implementations without external FPGA fabrics.
• Substantial embedded RAM: Approximately 42 Mbits of on‑chip memory reduces dependence on external DRAM for buffering and local data storage.
• Extensive I/O capacity: 600 user I/Os accommodate broad interfacing requirements and high‑pin‑count system designs.
• Industrial operating range: Rated −40 °C to 100 °C to meet temperature demands of industrial deployments.
• Compact, high‑pin package: 1760‑FCBGA (42.5 × 42.5 mm) package provides dense routing and system integration in a single surface‑mount component.
• Regulatory compliance: RoHS‑compliant to support environmentally responsible manufacturing and procurement.

Why Choose 5SGXEB5R2F43I3?

The 5SGXEB5R2F43I3 delivers a balance of very large programmable logic capacity, significant embedded memory and substantial I/O in an industrial‑grade FPGA package. Its combination of 490,000 logic elements, roughly 42 Mbits of on‑chip RAM and 600 I/O pins suits complex system designs that require high integration and flexible interfacing while operating across a broad temperature range.

This device is well suited to engineers and system designers building high‑density digital processing, advanced networking, and consolidated prototype systems who require a robust FPGA platform with verified supply and operating parameters.

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