5SGXEB5R2F43I3L
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 41984000 490000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 542 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 41984000 |
Overview of 5SGXEB5R2F43I3L – Stratix® V GX Field Programmable Gate Array (FPGA), 490,000 logic elements, 1760‑FCBGA
The 5SGXEB5R2F43I3L is an Intel Stratix V GX series FPGA supplied in a 1760‑FCBGA package. It delivers very high logic density and extensive I/O capacity for designs that require large amounts of programmable logic, embedded memory, and high‑performance I/O.
Targeted at industrial applications, this device combines a large logic fabric with a broad operating temperature range and low‑voltage core operation to address compute‑ and I/O‑intensive systems where reliability and integration matter.
Key Features
- High logic capacity 490,000 logic elements suitable for complex, high‑density designs.
- Embedded memory Approximately 42 Mbits of on‑chip RAM to support buffering, packet processing, and large lookup tables.
- Extensive I/O 600 user I/O pins to support wide parallel interfaces and multi‑lane PHYs.
- Transceiver capability (series) Stratix V GX family devices include high‑speed transceiver support (see series datasheet for supported channel rates up to 14.1 Gbps) to address high‑bandwidth serial links.
- Low‑voltage core Core supply range of 820 mV to 880 mV to match modern low‑voltage system domains.
- Industrial temperature grade Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
- Package and mounting 1760‑FBGA (1760‑FCBGA, 42.5 × 42.5 mm) surface‑mount package for compact, board‑level integration.
- RoHS compliant Manufactured in compliance with RoHS requirements.
Typical Applications
- High‑performance networking Large logic capacity and extensive I/O make this device suitable for packet processing, switches, and network acceleration.
- Telecommunications and optics Stratix V GX series transceiver capability and high I/O count enable multi‑lane serial links and protocol bridging in telecom equipment.
- Data center and compute acceleration Embedded memory and dense logic support hardware acceleration and custom offload functions.
- Industrial control and automation Industrial temperature grade and robust I/O support signal aggregation and real‑time control in harsh environments.
Unique Advantages
- High integration density: 490,000 logic elements reduce the need for multiple FPGAs and simplify system architecture.
- Generous on‑chip memory: Approximately 42 Mbits of embedded RAM supports large buffers and complex state machines without external memory.
- Large I/O complement: 600 I/Os provide flexibility for parallel interfaces, multiple transceiver lanes, and mixed signaling domains.
- Industrial robustness: −40 °C to 100 °C operating range supports deployment in industrial environments.
- Low‑voltage core operation: 820–880 mV supply range aligns with modern low‑power system rails and design practices.
- Compact FCBGA footprint: 1760‑FCBGA (42.5 × 42.5 mm) package balances high pin‑count with board‑level space efficiency.
Why Choose 5SGXEB5R2F43I3L?
The 5SGXEB5R2F43I3L delivers a combination of very large logic capacity, substantial embedded memory, and extensive I/O in a single industrial‑grade Stratix V GX device. Its specification targets applications that require significant programmable resources and reliable operation across a wide temperature range.
Backed by Intel's Stratix V family documentation, this device is suited for teams developing high‑bandwidth communications, compute acceleration, and industrial control systems that need a high‑density FPGA platform with documented electrical and operating characteristics.
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