5SGXEB5R2F43I3LN

The 5SGXEB5R2F43I3LN is a Stratix® V GX field programmable gate array (FPGA) IC designed for high-density programmable logic and substantial on‑chip memory. This device delivers 490,000 logic elements, approximately 42 Mbits of embedded RAM, and 600 user I/O pins in a 1760‑FCBGA (42.5 × 42.5 mm) package.

Specified for industrial applications, the device supports a core voltage supply range of 820 mV to 880 mV and an operating temperature range of −40 °C to 100 °C, providing a robust platform for complex, high‑I/O system designs.

Key Features

• Core Logic — 490,000 logic elements provide a large programmable fabric for complex digital designs and custom processing algorithms.
• Logic Array Blocks — 185,000 LABs (logic array blocks) for structured implementation of logic functions and hierarchical design.
• Embedded Memory — Approximately 42 Mbits of total on‑chip RAM (41,984,000 bits) to support large buffers, state machines, and data‑path storage without external memory.
• I/O Capacity — 600 I/O pins to enable dense interfacing with peripherals, sensors, high‑speed front ends, and system mezzanines.
• Power and Voltage — Core voltage supply specified between 820 mV and 880 mV for the device core.
• Package & Mounting — 1760‑FBGA / 1760‑FCBGA package (42.5 × 42.5 mm), surface‑mount for compact board integration.
• Temperature & Grade — Industrial grade operation with an operating temperature range of −40 °C to 100 °C.
• Environmental Compliance — RoHS‑compliant product.

Typical Applications

• Industrial Control: Industrial temperature rating and wide operating range make this FPGA suitable for factory automation, motion control, and embedded control systems requiring robust operation.
• High‑density Logic and Acceleration: Large logic element count and substantial on‑chip RAM support custom compute accelerators, signal processing pipelines, and algorithm offloads.
• High‑I/O Systems: The 600 I/O pins enable complex sensor arrays, data aggregation, and multi‑channel interface designs where connectivity density matters.

Unique Advantages

• Large programmable fabric: 490,000 logic elements enable extensive logic integration and reduce the need for multiple devices in high‑complexity designs.
• Significant on‑chip memory: Approximately 42 Mbits of embedded RAM minimizes external memory dependence and shortens data paths for lower latency.
• High I/O count: 600 I/Os allow dense external connectivity for multi‑channel and multi‑protocol systems.
• Industrial reliability: Specified for −40 °C to 100 °C operation to meet demanding environmental requirements.
• Compact high‑pin package: 1760‑FCBGA (42.5 × 42.5 mm) delivers a high‑pin‑count solution in a single surface‑mount package for space‑constrained boards.
• Low‑voltage core operation: 820–880 mV core supply supports modern low‑voltage FPGA architectures.

Why Choose 5SGXEB5R2F43I3LN?

This Stratix® V GX FPGA combines high logic density, substantial embedded memory, and an expansive I/O footprint in a single industrial‑grade package, making it well suited for designs that require integrated, high‑capacity programmable logic. Its package and electrical specifications support compact board layouts while delivering the resources necessary for complex signal processing, control, and interfacing tasks.

Choose the 5SGXEB5R2F43I3LN for projects that demand a scalable, reliable FPGA platform with significant on‑chip resources and high connectivity, especially in industrial environments where operating temperature range and RoHS compliance are important considerations.

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