5SGXEB5R2F43I3LG

The 5SGXEB5R2F43I3LG is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, supplied in a 1760-FCBGA (1760-BBGA) surface-mount package. This industrial-grade device delivers very large programmable logic capacity paired with substantial on‑chip memory and a high pin count for dense, I/O‑intensive designs.

Designed for applications that demand extensive logic resources and embedded memory, the device combines 490,000 logic elements with approximately 42 Mbits of embedded RAM and 600 user I/O pins to support complex, high‑capacity implementations.

Key Features

• Core density — 490,000 logic elements and 185,000 logic array blocks (LABs) provide very large programmable logic capacity for complex designs.
• Embedded memory — Total on‑chip memory of 41,984,000 bits (approximately 42 Mbits) for large buffer, FIFO, and state‑storage requirements.
• I/O resources — 600 user I/O pins to support dense external connectivity and parallel interfaces.
• Power domain — Core supply range of 820 mV to 880 mV to match platform power requirements and enable defined core operation.
• Package & mounting — 1760‑FBGGA / 1760‑FCBGA package format (1760‑FCBGA, 42.5×42.5 mm); surface-mount for PCB integration.
• Industrial temperature range — Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory — RoHS compliant.

Typical Applications

• Large-scale programmable systems — Ideal for designs requiring hundreds of thousands of logic elements and substantial on‑chip RAM.
• I/O‑intensive platforms — Suited for boards and modules that need hundreds of user I/O signals for parallel and multi‑lane interfaces.
• Industrial embedded systems — The industrial temperature grade and surface‑mount package support deployment in robust, temperature‑variant installations.

Unique Advantages

• Massive logic capacity: 490,000 logic elements and 185,000 LABs reduce the need to partition designs across multiple devices.
• Substantial on‑chip memory: Approximately 42 Mbits of embedded RAM enables large buffering and state storage without external memory.
• High I/O count: 600 user I/Os allow complex external interfacing and parallel connectivity without excessive board-level routing compromises.
• Industrial robustness: −40 °C to 100 °C operating range and industrial grade designation support deployment in temperature‑challenging environments.
• Compact system integration: 1760‑FCBGA (42.5×42.5 mm) surface‑mount package balances density with manageable PCB layout for high‑performance modules.
• Standards‑aware manufacturing: RoHS compliance supports environmentally regulated production processes.

Why Choose 5SGXEB5R2F43I3LG?

The 5SGXEB5R2F43I3LG positions itself as a high‑density Stratix V GX FPGA option for engineers who require extensive programmable logic, considerable embedded memory, and a large number of I/O in an industrial‑rated, surface‑mount package. Its combination of 490,000 logic elements, approximately 42 Mbits of on‑chip RAM, and 600 I/Os provides the resource headroom needed for complex, integrated FPGA implementations.

Choose this device for designs that demand scalability and reliability in industrial environments, and for projects where consolidating logic and memory on a single FPGA reduces board complexity and BOM count while preserving design flexibility.

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