5SGXEB5R2F43I2N

The 5SGXEB5R2F43I2N is an Intel Stratix V GX field programmable gate array supplied in a 1760-FCBGA package. It provides high on-chip logic capacity and memory with a large I/O count for demanding industrial applications.

Key architectural highlights include approximately 490,000 logic elements, approximately 42 Mbits of embedded memory, and support for up to 600 I/Os. The device operates from a core voltage range of 870 mV to 930 mV and is specified for industrial temperature operation.

Key Features

• Core Logic  Approximately 490,000 logic elements for large-scale programmable logic integration and complex design implementation.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage.
• I/O Density  Up to 600 I/Os to handle extensive external interfacing and parallel connectivity requirements.
• Voltage Supply  Core voltage operating range of 870 mV to 930 mV for compatibility with low-voltage FPGA core rails.
• Package & Mounting  1760-FCBGA (42.5 × 42.5 mm) surface-mount package offering a high-pin-count footprint for dense board integration.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C, suitable for temperature-challenging environments.
• Regulatory Compliance  RoHS-compliant construction.

Typical Applications

• FPGA-based systems  Designs that require approximately 490,000 logic elements and significant embedded memory for custom hardware acceleration or protocol handling.
• High-density I/O processing  Systems needing up to 600 I/Os for wide parallel interfaces, sensor aggregation, or protocol bridging.
• Industrial control and instrumentation  Deployments that benefit from industrial temperature rating (–40 °C to 100 °C) and robust on-chip resources.

Unique Advantages

• Large programmable fabric: The substantial logic element count enables complex, high-density designs without external logic expansion.
• Significant on-chip memory: Approximately 42 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage.
• Extensive I/O capacity: Up to 600 I/Os simplifies integration of many parallel interfaces and external peripherals.
• Industrial-grade operation: Specified for –40 °C to 100 °C operation to meet the needs of temperature-demanding deployments.
• High-pin-count FCBGA package: The 1760-FCBGA (42.5 × 42.5 mm) provides the footprint and pin density required for dense system integration.
• RoHS-compliant: Environmentally compliant manufacturing and materials.

Why Choose 5SGXEB5R2F43I2N?

The 5SGXEB5R2F43I2N delivers a balance of high logic density, substantial embedded memory, and large I/O capability in a single industrial-grade Stratix V GX package. Its combination of approximately 490,000 logic elements, roughly 42 Mbits of on-chip RAM, and 600 I/Os makes it well suited for complex FPGA designs that require integration, connectivity, and temperature robustness.

This device is appropriate for engineering teams building high-density programmable systems where board-level integration and long-term availability of a platform with industrial operating range are important considerations.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGXEB5R2F43I2N. Our team can provide ordering information and support for your procurement and design planning needs.