5SGXEB5R2F43I3G

IC FPGA 600 I/O 1760FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 41984000 490000 1760-BBGA, FCBGA

Quantity 746 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits41984000

Overview of 5SGXEB5R2F43I3G – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXEB5R2F43I3G is a Stratix V GX family FPGA from Intel, delivered in a 1760-FCBGA surface-mount package (42.5 × 42.5 mm) and specified for industrial operation. This device integrates large programmable logic capacity, extensive on-chip memory, and a high I/O count to address designs that require high-density logic, significant embedded RAM, and broad interfacing capability.

Targeted at applications that demand robust operation across an extended temperature range, the device operates from a core supply of 820 mV to 880 mV and is specified for operation from −40 °C to 100 °C. The device is RoHS compliant and packaged for high-density board integration.

Key Features

  • Core / Logic — 490,000 logic elements, providing substantial programmable logic resources for complex designs.
  • Embedded Memory — Approximately 42 Mbits of on-chip RAM (41,984,000 total RAM bits) to support buffering, state machines, and data-path storage.
  • I/O Capacity — 600 user I/O pins to accommodate high-pin-count interfaces and dense peripheral connectivity.
  • Transceiver Series Capability — Stratix V GX series documentation includes GX transceiver support and speed-grade options; refer to product documentation for series transceiver specifications.
  • Power and Supply — Core supply voltage range of 820 mV to 880 mV for device operation.
  • Package and Mounting — 1760-BBGA, FCBGA package (1760-FCBGA, 42.5 × 42.5 mm) designed for surface-mount assembly.
  • Industrial Grade Temperature — Specified operating temperature range of −40 °C to 100 °C for use in industrial environments.
  • Regulatory — RoHS compliant.

Typical Applications

  • High-density logic and memory designs — Implements complex state machines, pipelines, and large combinational logic with the device’s 490,000 logic elements and ~42 Mbits of embedded RAM.
  • High-throughput serial link systems — Appropriate for designs leveraging the Stratix V GX series transceiver capabilities (see device documentation for series-level transceiver speed grades).
  • Industrial control and automation — Industrial temperature grade (−40 °C to 100 °C) and high I/O count make the device suitable for demanding control, monitoring, and interface tasks.
  • High I/O interface hubs — 600 I/Os allow dense connectivity for multi-protocol bridging, sensor aggregation, and high-pin-count peripheral control.

Unique Advantages

  • High logic capacity: 490,000 logic elements enable large-scale programmable designs without immediate need for multiple devices.
  • Substantial embedded memory: Approximately 42 Mbits of on-chip RAM reduces external memory dependence for many buffering and data-path requirements.
  • Large I/O footprint: 600 I/O pins provide flexibility for complex interfacing and parallel I/O requirements.
  • Industrial-rated operation: −40 °C to 100 °C operating range supports deployment in industrial environments.
  • Compact FCBGA packaging: 1760-FCBGA (42.5 × 42.5 mm) balances high integration with board-level density suitable for advanced system designs.
  • RoHS compliant: Environmentally compliant material status for global manufacturing requirements.

Why Choose 5SGXEB5R2F43I3G?

The 5SGXEB5R2F43I3G brings together a large programmable fabric, significant embedded RAM, and a very high I/O count in a single industrial-grade FCBGA package. These characteristics make it well suited to system designs that require dense logic, on-chip memory, and broad interfacing while operating across an extended temperature range.

As a member of the Stratix V GX family from Intel, the device benefits from series-level documentation and specifications covering electrical, switching, and transceiver characteristics. Choose this part when your design needs scalable logic and memory capacity with industrial temperature capability and a compact, high-pin-count package.

Request a quote or submit an inquiry for pricing and availability to begin evaluating the 5SGXEB5R2F43I3G for your next design.

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