5SGXEB5R2F43I3G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 41984000 490000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 746 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 41984000 |
Overview of 5SGXEB5R2F43I3G – Stratix® V GX Field Programmable Gate Array (FPGA) IC
The 5SGXEB5R2F43I3G is a Stratix V GX family FPGA from Intel, delivered in a 1760-FCBGA surface-mount package (42.5 × 42.5 mm) and specified for industrial operation. This device integrates large programmable logic capacity, extensive on-chip memory, and a high I/O count to address designs that require high-density logic, significant embedded RAM, and broad interfacing capability.
Targeted at applications that demand robust operation across an extended temperature range, the device operates from a core supply of 820 mV to 880 mV and is specified for operation from −40 °C to 100 °C. The device is RoHS compliant and packaged for high-density board integration.
Key Features
- Core / Logic — 490,000 logic elements, providing substantial programmable logic resources for complex designs.
- Embedded Memory — Approximately 42 Mbits of on-chip RAM (41,984,000 total RAM bits) to support buffering, state machines, and data-path storage.
- I/O Capacity — 600 user I/O pins to accommodate high-pin-count interfaces and dense peripheral connectivity.
- Transceiver Series Capability — Stratix V GX series documentation includes GX transceiver support and speed-grade options; refer to product documentation for series transceiver specifications.
- Power and Supply — Core supply voltage range of 820 mV to 880 mV for device operation.
- Package and Mounting — 1760-BBGA, FCBGA package (1760-FCBGA, 42.5 × 42.5 mm) designed for surface-mount assembly.
- Industrial Grade Temperature — Specified operating temperature range of −40 °C to 100 °C for use in industrial environments.
- Regulatory — RoHS compliant.
Typical Applications
- High-density logic and memory designs — Implements complex state machines, pipelines, and large combinational logic with the device’s 490,000 logic elements and ~42 Mbits of embedded RAM.
- High-throughput serial link systems — Appropriate for designs leveraging the Stratix V GX series transceiver capabilities (see device documentation for series-level transceiver speed grades).
- Industrial control and automation — Industrial temperature grade (−40 °C to 100 °C) and high I/O count make the device suitable for demanding control, monitoring, and interface tasks.
- High I/O interface hubs — 600 I/Os allow dense connectivity for multi-protocol bridging, sensor aggregation, and high-pin-count peripheral control.
Unique Advantages
- High logic capacity: 490,000 logic elements enable large-scale programmable designs without immediate need for multiple devices.
- Substantial embedded memory: Approximately 42 Mbits of on-chip RAM reduces external memory dependence for many buffering and data-path requirements.
- Large I/O footprint: 600 I/O pins provide flexibility for complex interfacing and parallel I/O requirements.
- Industrial-rated operation: −40 °C to 100 °C operating range supports deployment in industrial environments.
- Compact FCBGA packaging: 1760-FCBGA (42.5 × 42.5 mm) balances high integration with board-level density suitable for advanced system designs.
- RoHS compliant: Environmentally compliant material status for global manufacturing requirements.
Why Choose 5SGXEB5R2F43I3G?
The 5SGXEB5R2F43I3G brings together a large programmable fabric, significant embedded RAM, and a very high I/O count in a single industrial-grade FCBGA package. These characteristics make it well suited to system designs that require dense logic, on-chip memory, and broad interfacing while operating across an extended temperature range.
As a member of the Stratix V GX family from Intel, the device benefits from series-level documentation and specifications covering electrical, switching, and transceiver characteristics. Choose this part when your design needs scalable logic and memory capacity with industrial temperature capability and a compact, high-pin-count package.
Request a quote or submit an inquiry for pricing and availability to begin evaluating the 5SGXEB5R2F43I3G for your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018