5SGXEB5R2F43I2LN

The 5SGXEB5R2F43I2LN is a Stratix® V GX family FPGA from Intel, delivered in a 1760‑pin FCBGA package. It provides a high logic capacity device with a large on‑chip memory complement and substantial I/O resources for designs that require dense programmable logic and extensive interfacing.

This industrial‑grade device supports wide operating temperatures and low core voltage operation, making it suitable for industrial and harsh‑environment applications where high integration and robust thermal performance are required.

Key Features

• Core Logic Capacity — Approximately 490,000 logic elements, enabling complex digital designs and large logic integration on a single device.
• Logic Array Resources — 185,000 logic array resources as reported in the device specification set.
• Embedded Memory — Approximately 42 Mbits of on‑chip RAM for data buffering, FIFOs, and local storage.
• I/O Count — 600 general‑purpose I/O pins to support high‑pin‑count interfaces and multiple concurrent external connections.
• Power Supply — Core supply range of 820 mV to 880 mV to match system power‑rail design requirements.
• Package & Mounting — 1760‑FCBGA package (42.5 × 42.5 mm) in a surface‑mount format for compact, high‑density board layouts.
• Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for reliable operation in demanding environments.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control & Automation — Use the device’s industrial temperature rating and high logic density to implement control logic, sequencing, and protocol conversion in factory and process automation systems.
• High‑Density Digital Processing — Large logic element and embedded memory resources support digital signal processing, custom compute engines, and complex state machines for compute‑intensive tasks.
• Interfaces & I/O Aggregation — 600 I/Os enable aggregation of multiple high‑pin‑count interfaces, bridging, and custom peripheral integration on a single FPGA platform.

Unique Advantages

• High Logic Density: Approximately 490,000 logic elements provide the capacity to implement large, integrated systems without multiple FPGAs.
• Significant On‑Chip Memory: Roughly 42 Mbits of embedded RAM reduces dependency on external memory for buffering and local storage.
• Extensive I/O Resources: 600 I/O pins support complex multi‑channel interfaces and flexible board‑level connectivity.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, supporting deployments in industrial and temperature‑challenging environments.
• Compact High‑Pin Package: 1760‑FCBGA (42.5 × 42.5 mm) surface‑mount package enables dense PCB implementations while maintaining high pin count.
• Low‑Voltage Core Operation: Core supply range of 820 mV–880 mV aligns with modern low‑voltage FPGA power architectures.

Why Choose 5SGXEB5R2F43I2LN?

The 5SGXEB5R2F43I2LN combines large logic capacity, substantial embedded memory, and a high I/O count in a single industrial‑grade Stratix V GX FPGA package. It is positioned for designs that require tight integration of complex digital functions, extensive peripheral interfacing, and reliable operation across a wide temperature range.

This device is well suited for engineering teams building high‑density programmable systems in industrial, communications, and advanced digital processing markets where on‑chip resources and robust temperature performance reduce system complexity and BOM count.

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