5SGXEB5R3F40C2L

The 5SGXEB5R3F40C2L is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) supplied in a 1517‑FBGA (40×40) package. It delivers high logic density and substantial on‑chip RAM in a commercial‑grade FPGA intended for complex, high‑density programmable designs.

With 490,000 logic elements, approximately 42 Mbits of embedded memory, and 432 user I/O, this device targets designs that require large programmable logic capacity, significant embedded storage, and broad I/O connectivity while operating within a commercial temperature range.

Key Features

• High Logic Density  490,000 logic elements to implement large, complex FPGA designs.
• Embedded Memory  Approximately 42 Mbits of on‑chip RAM for buffering, state storage, and on‑die data structures.
• Extensive I/O  432 user I/O pins to support multiple interfaces and parallel connections.
• Package & Mounting  1517‑FBGA (40×40) package in a surface‑mount form factor for compact board integration.
• Power Supply Range  Core voltage supply specified from 820 mV to 880 mV.
• Commercial Grade Temperature  Rated for 0 °C to 85 °C operating temperature.
• RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

• High‑density digital systems  Large FPGA designs that require extensive logic resources and embedded RAM.
• Multi‑interface controllers  Applications that need broad I/O counts for interfacing multiple peripherals or parallel busses.
• Commercial embedded platforms  Embedded systems operating within 0 °C to 85 °C where commercial‑grade components are specified.

Unique Advantages

• Large programmable fabric  490,000 logic elements enable consolidation of complex functions into a single device, reducing board-level part count.
• Substantial on‑chip memory  Approximately 42 Mbits of embedded RAM supports large buffers and local data storage, improving latency and throughput for memory‑intensive tasks.
• High I/O capacity  432 I/O pins allow flexible partitioning of signals and support for multiple simultaneous interfaces.
• Compact BGA package  1517‑FBGA (40×40) surface‑mount package helps keep board area low while supporting high pin counts.
• Commercial temperature suitability  Specified 0 °C to 85 °C operation aligns with a wide range of commercial products and environments.
• Regulatory compliance  RoHS compliance supports environmentally conscious designs and supply‑chain requirements.

Why Choose 5SGXEB5R3F40C2L?

The 5SGXEB5R3F40C2L combines large logic capacity, significant embedded RAM, and a high I/O count in a compact 1517‑FBGA package, making it well suited for designs that consolidate multiple functions into a single FPGA. Its commercial temperature rating and RoHS compliance make it appropriate for mainstream embedded and digital systems.

As a member of the Intel Stratix V GX family, this device provides designers with a high‑density programmable platform that aligns with projects requiring robust logic resources and on‑chip memory while maintaining a compact footprint and standard commercial operating conditions.

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