5SGXEB5R3F40C2N

The 5SGXEB5R3F40C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1517‑FBGA (40×40) surface‑mount package. It targets designs that require very high logic capacity, substantial on‑chip memory, and a large number of I/O pins in a compact commercial‑grade form factor.

With 490,000 logic elements, 432 I/Os, and approximately 42 Mbits of embedded memory, this device is suitable for complex digital processing, high‑density interfacing, and systems where integration and board‑level space efficiency are priorities. It is RoHS compliant and specified for commercial operating temperatures.

Key Features

• Logic Capacity — Approximately 490,000 logic elements to implement large-scale digital designs and complex logic functions.
• Embedded Memory — Approximately 42 Mbits of on‑chip RAM to support buffering, large state machines, and memory‑intensive logic without immediate external memory requirements.
• I/O Density — 432 user I/Os for high‑pin‑count interfaces, multiple parallel buses, and extensive peripheral connectivity.
• Power Supply — Low‑voltage core operation specified at 0.82 V to 0.88 V to match modern low‑voltage system rails.
• Package & Mounting — 1517‑FBGA (40×40) package in a surface‑mount form factor for compact board designs and reliable solder attach.
• Operating Grade & Temperature — Commercial grade with an operating range of 0 °C to 85 °C for typical commercial and enterprise applications.
• Regulatory Compliance — RoHS compliant, supporting regulatory and environmental requirements for lead‑free assembly.

Typical Applications

• High‑density digital signal processing — Implement large algorithmic blocks and pipelines using the device’s high logic element count and substantial on‑chip RAM.
• Telecommunications and networking — Use the plentiful I/Os and memory to build protocol handling, packet processing, and interface aggregation functions.
• High‑performance custom logic — Integrate complex state machines, custom accelerators, or application‑specific datapaths that require significant gate count and local memory.

Unique Advantages

• High integration density: 490,000 logic elements and approximately 42 Mbits of embedded memory reduce the need for external devices in complex designs.
• Large I/O complement: 432 I/Os allow consolidation of multiple interfaces and sensors without sacrificing board routing flexibility.
• Compact package: 1517‑FBGA (40×40) surface‑mount package delivers a high pin count in a space‑efficient footprint.
• Low‑voltage core operation: 0.82–0.88 V supply range aligns with modern low‑voltage power domains for efficient system integration.
• Commercial readiness: Specified 0 °C to 85 °C operating range and RoHS compliance support mainstream commercial product deployments.

Why Choose 5SGXEB5R3F40C2N?

The 5SGXEB5R3F40C2N offers a combination of very high logic capacity, substantial embedded memory, and extensive I/O in a compact 1517‑FBGA package, making it well suited for designers building complex digital systems that demand integration and board‑space efficiency. As a commercial‑grade Intel Stratix V GX FPGA, it fits applications where large programmable fabric and on‑chip storage are required within standard commercial temperature limits.

This device is appropriate for engineering teams focused on high‑density logic implementations, protocol and interface consolidation, and memory‑heavy on‑chip designs seeking a single‑chip programmable solution backed by a recognized FPGA manufacturer.

Request a quote or submit an inquiry for pricing and availability of the 5SGXEB5R3F40C2N to begin evaluating this device for your design needs.