5SGXEB5R3F40C3N

The 5SGXEB5R3F40C3N is a Stratix V GX field programmable gate array supplied in a 1517-FBGA (40×40) package for surface-mount assembly. It delivers a high-density programmable fabric with 490,000 logic elements and approximately 42 Mbits of embedded memory, making it suitable for complex, logic-intensive commercial designs.

With 432 user I/Os and a low-voltage core supply range of 820 mV to 880 mV, this device targets applications that require large logic capacity, substantial on-chip memory, and a high pin count within a compact BGA footprint. It is rated for commercial operation from 0°C to 85°C and is RoHS compliant.

Key Features

• High Logic Density — 490,000 logic elements to support large-scale programmable designs and complex logic integration.
• On-chip Memory — Approximately 42 Mbits of embedded RAM to support buffering, state storage, and intermediate data handling without external memory for many functions.
• High I/O Count — 432 user I/Os to accommodate broad interfacing needs across peripherals, memory, and high-pin-count system connections.
• Low-Voltage Core — Core supply range of 820 mV to 880 mV for compatibility with low-voltage system power architectures.
• Package & Mounting — 1517-FBGA (40×40) surface-mount package for dense board integration in space-constrained designs.
• Commercial Temperature Grade — Specified for operation from 0°C to 85°C for commercial applications.
• RoHS Compliant — Meets standard environmental compliance for lead-free assembly.

Typical Applications

• High-density logic consolidation — Use the 490,000 logic elements to integrate multiple discrete functions into a single programmable device.
• On-chip buffering and data handling — Approximately 42 Mbits of embedded memory supports packet buffering, lookup tables, and intermediate data storage without immediate reliance on external RAM.
• Complex I/O aggregation — 432 I/Os enable diverse system interfacing, consolidating connections for high-pin-count peripherals and subsystems.

Unique Advantages

• High-density programmable fabric: 490,000 logic elements enable implementation of large logic designs and complex custom algorithms inside a single FPGA.
• Substantial embedded memory: Approximately 42 Mbits of on-chip RAM reduces dependence on external memory for many buffering and data-processing tasks.
• Broad I/O capability: 432 user I/Os simplify board-level routing and support extensive system interfacing without additional I/O expanders.
• Compact BGA packaging: The 1517-FBGA (40×40) package provides a space-efficient footprint for dense PCB layouts and surface-mount assembly.
• Commercial ready: Rated for 0°C to 85°C operation and RoHS compliant for standard commercial deployments.
• Low-voltage core operation: 820 mV to 880 mV core supply range aligns with modern low-voltage power domains.

Why Choose 5SGXEB5R3F40C3N?

The 5SGXEB5R3F40C3N positions itself as a high-capacity Stratix V GX FPGA option for designers who need substantial logic resources, significant embedded memory, and a large I/O complement in a compact surface-mount BGA package. Its combination of 490,000 logic elements, approximately 42 Mbits of RAM, and 432 I/Os supports consolidation of complex functions and extensive interfacing within commercial-temperature systems.

This device is suited for customers designing logic-intensive, board- or system-level solutions that require scalability in programmable logic and on-chip memory while maintaining a compact footprint and RoHS-compliant assembly.

Request a quote or submit your requirements to receive pricing and availability information for the 5SGXEB5R3F40C3N.