5SGXEB5R3F40C4G

The 5SGXEB5R3F40C4G is a Stratix V GX field‑programmable gate array from Intel, offered in a 1517‑FBGA (40×40) surface‑mount package. This high‑density FPGA provides 490,000 logic elements, approximately 42 Mbits of embedded RAM, and 432 user I/O pins for complex, pin‑rich digital designs.

Rated for commercial operation (0 °C to 85 °C) and RoHS compliant, the device targets designs that require large on‑chip logic and memory capacity combined with a high I/O count and low‑voltage core operation (820 mV to 880 mV).

Key Features

• Logic Fabric  Approximately 490,000 logic elements for implementing large-scale programmable logic and complex RTL designs.
• Embedded Memory  Approximately 42 Mbits of on‑chip RAM to support large buffers, FIFOs, and local data storage.
• I/O Capacity  432 user I/O pins to support high‑pin‑count interfaces and multi‑channel connectivity.
• Package & Mounting  1517‑FBGA (40×40) package in a surface‑mount format for compact board integration.
• Power  Core voltage supply range of 820 mV to 880 mV, enabling integration into low‑voltage power architectures.
• Temperature Grade  Commercial grade operation from 0 °C to 85 °C for standard commercial applications.
• Compliance  RoHS compliant for environmentally conscious designs.
• Device Family  Stratix V GX series — device datasheet and electrical characteristics are provided as part of the Stratix V device documentation.

Typical Applications

• High‑density programmable systems  Implement complex logic functions and custom datapaths that require large logic capacity and significant on‑chip memory.
• Multi‑channel interface hubs  Leverage 432 I/O pins to aggregate and route many parallel interfaces in communication or data‑acquisition systems.
• Embedded processing accelerators  Use the combination of abundant logic elements and embedded RAM for hardware acceleration of compute‑intensive kernels.

Unique Advantages

• Large programmable capacity: 490,000 logic elements provide the headroom for complex SoC‑class FPGA designs without immediate upcycling.
• Substantial on‑chip RAM: Approximately 42 Mbits of embedded memory reduces dependence on external RAM for buffering and local storage.
• High I/O count: 432 user I/Os simplify board routing and support multi‑lane or multi‑channel designs without extensive external multiplexing.
• Compact BGA packaging: 1517‑FBGA (40×40) enables dense board layouts while retaining a high pin count for system I/O.
• Low‑voltage core operation: 820 mV–880 mV core supply aligns with modern low‑voltage power rails for efficient system design.
• Commercial readiness: Rated for 0 °C–85 °C operation and RoHS compliant, suitable for mainstream commercial product deployments.

Why Choose 5SGXEB5R3F40C4G?

The 5SGXEB5R3F40C4G delivers a balance of high logic density, substantial embedded memory, and a large I/O complement in a compact FBGA package—making it well suited to demanding commercial FPGA applications that require on‑chip capacity and connectivity. As a member of the Stratix V GX family from Intel, the device is supported by the Stratix V device documentation and electrical specifications to aid design evaluation and system integration.

This combination of capacity, I/O, and low‑voltage operation provides a practical platform for engineers building complex, scalable FPGA‑based subsystems that require predictable commercial‑grade operation and regulatory compliance for lead‑free manufacturing.

Request a quote or submit your RFQ to begin procurement and evaluation of the 5SGXEB5R3F40C4G for your next high‑density FPGA design.