5SGXEB5R3F40C3G

The 5SGXEB5R3F40C3G is a Stratix® V GX field-programmable gate array (FPGA) offered in a 1517‑FBGA (40×40) surface-mount package. This commercial‑grade device provides 490,000 logic elements, approximately 42 Mbits of embedded RAM, and 432 user I/O pins, supporting complex, high‑capacity digital designs.

With a specified core supply range of 820 mV to 880 mV and an operating temperature range of 0 °C to 85 °C, this device targets designs that require substantial on‑chip logic and memory resources within standard commercial thermal and power envelopes.

Key Features

• Core Logic Capacity  490,000 logic elements allow implementation of large digital designs and high‑density logic functions.
• Embedded Memory  Approximately 42 Mbits of on‑chip RAM for data buffering, FIFOs, and on‑chip storage.
• I/O  432 user I/O pins provided for broad peripheral connectivity and board‑level integration.
• Package & Mounting  1517‑FBGA (40×40) package in a surface‑mount form factor for compact PCB layouts.
• Power  Core voltage supply specified at 820 mV to 880 mV to match system power requirements.
• Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.
• Stratix V GX Series Transceiver Options  Stratix V GX devices are offered in transceiver speed grades that include GX channel options (for example, 14.1 Gbps and 12.5 Gbps as indicated in the Stratix V device datasheet).

Typical Applications

• High‑density digital systems  Use the large logic capacity and extensive I/O to integrate complex control and processing functions on a single device.
• Communications and networking  Leverage the GX family transceiver speed‑grade options and abundant logic/memory resources for packet processing and protocol acceleration.
• Signal processing  On‑chip RAM and high logic element count support DSP algorithms, buffering, and streaming data paths.
• Prototyping and SoC integration  Deploy as a development platform for validating large FPGA partitions or for integrating multiple system functions.

Unique Advantages

• Substantial logic density: 490,000 logic elements enable consolidation of large functions into a single FPGA, reducing external logic and board complexity.
• Significant embedded memory: Approximately 42 Mbits of RAM supports on‑chip data buffering and state storage, minimizing external memory requirements.
• High I/O count: 432 I/O pins provide flexible connectivity for interfaces, peripherals, and multi‑lane I/O structures.
• Commercial operating profile: Specified 0 °C to 85 °C operating range and RoHS compliance align with standard commercial product lifecycles and manufacturing requirements.
• FBGA package for dense PCBs: The 1517‑FBGA (40×40) surface‑mount package supports compact board designs while delivering the device’s full I/O complement.

Why Choose 5SGXEB5R3F40C3G?

The 5SGXEB5R3F40C3G positions itself where high logic capacity, substantial embedded memory, and large I/O counts are required within a commercial temperature profile. Its Stratix V GX family heritage and documented transceiver speed‑grade options make it suitable for demanding digital and communications applications that benefit from on‑chip integration.

This device is well suited to engineering teams and product designs that need scalable logic resources, extensive on‑chip RAM, and broad I/O options while adhering to commercial‑grade operating conditions and RoHS requirements.

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