5SGXEB5R3F40C4N

The 5SGXEB5R3F40C4N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC offering approximately 490,000 logic elements and approximately 42 Mbits of embedded memory. The device provides 432 I/O signals in a 1517‑FBGA (40×40) surface‑mount package.

Targeted for commercial applications, this FPGA operates from a core supply range of 820 mV to 880 mV and is specified for an operating temperature range of 0 °C to 85 °C. It is RoHS compliant.

Key Features

• Core Logic Capacity  Approximately 490,000 logic elements for implementing large-scale digital designs and complex custom logic.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM to support buffering and state storage within the FPGA fabric.
• I/O Density & Package  432 I/O pins provided in a 1517‑FBGA (40×40) package, optimized for high‑density board integration.
• Power Supply  Core voltage supply range from 820 mV to 880 mV for accurate power planning at system level.
• Mounting & Compliance  Surface mount package and RoHS compliance for modern assembly and regulatory requirements.
• Operating Range & Grade  Commercial grade device specified for 0 °C to 85 °C operation.

Typical Applications

• High‑density digital designs  Deploy substantial logic capacity and on‑chip memory to implement complex datapaths and large finite‑state machines.
• I/O‑rich systems  Use the 432 available I/Os to interface with multiple peripherals, sensors, and external devices at the board level.
• Prototyping and hardware validation  Leverage the large logic and memory resources for hardware proof‑of‑concepts and algorithm validation in commercial projects.
• Commercial embedded systems  Integrate into systems operating within the 0 °C to 85 °C commercial temperature range.

Unique Advantages

• Large on‑chip resources:  Approximately 490,000 logic elements and ~42 Mbits of embedded memory reduce the need for external logic and external RAM in many designs.
• High I/O count:  432 I/Os simplify board‑level integration when multiple interfaces or parallel signals are required.
• Compact FBGA footprint:  1517‑FBGA (40×40) surface‑mount package enables high‑density PCB layouts while supporting robust pin counts.
• Defined power envelope:  A clear core supply range (820 mV–880 mV) helps streamline power‑supply design and validation.
• Commercial temperature rating:  Specified 0 °C to 85 °C operation for mainstream commercial deployments.
• RoHS compliance:  Meets common environmental requirements for commercial electronics manufacturing.

Why Choose 5SGXEB5R3F40C4N?

The 5SGXEB5R3F40C4N combines a very large logic element count with substantial on‑chip memory and a high I/O complement in a compact 1517‑FBGA package, making it well suited for commercial projects that require dense logic integration and extensive board‑level interfacing. Its defined core voltage range and commercial temperature rating simplify system power and thermal planning.

This part is appropriate for engineering teams designing complex digital systems, I/O‑heavy applications, and commercial embedded products that benefit from a high‑capacity FPGA with clear electrical and thermal specifications.

If you would like availability, pricing, or to request a quote for the 5SGXEB5R3F40C4N, please submit an inquiry or request a quote through your preferred procurement channel.