5SGXEB5R3F40I3L

The 5SGXEB5R3F40I3L is an Intel Stratix V GX Field Programmable Gate Array in a 1517‑FBGA (40×40) package designed for industrial-grade applications. It combines high logical density, plentiful embedded memory, and a large I/O count to address complex, high‑function digital designs that require robust operation across a wide temperature range.

Key Features

• Core Logic 490,000 logic elements (cells) and 185,000 LABs provide substantial programmable logic capacity for large, integrated designs.
• Embedded Memory Approximately 42 Mbits of on‑chip RAM to support wide, memory‑intensive workloads and buffering needs.
• I/O Resources 432 programmable I/O pins to support dense connectivity and multiple external interfaces.
• Power Supply Core voltage supply range of 820 mV to 880 mV to match system power domains and core‑voltage planning.
• Package & Mounting 1517‑FBGA (40×40) surface‑mount package for compact, board‑level integration.
• Temperature & Grade Industrial grade with operating temperature from −40 °C to 100 °C for deployment in demanding environments.
• Regulatory RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• High‑density digital systems — Large logic capacity and abundant embedded RAM enable implementation of complex state machines, data processing pipelines, and custom accelerators.
• Industrial control and automation — Industrial temperature rating and extensive I/O make the device suitable for control systems requiring reliable operation across wide temperature ranges.
• Communication and interfacing — High I/O count supports multi‑lane interfacing, protocol bridging, and system aggregation tasks that need many external connections.

Unique Advantages

• Large programmable fabric: 490,000 logic elements deliver the capacity to consolidate multiple functions into a single device, reducing system complexity.
• Substantial on‑chip memory: Approximately 42 Mbits of embedded RAM helps minimize external memory requirements and improves data path performance.
• High I/O density: 432 I/Os provide flexibility for complex board designs and multiple peripheral connections.
• Industrial reliability: Rated for −40 °C to 100 °C operation to support industrial deployments and extended temperature environments.
• Compact packaging: 1517‑FBGA (40×40) surface‑mount package balances board space efficiency with I/O and thermal considerations.
• Regulatory compliance: RoHS compliance simplifies integration into environmentally regulated products.

Why Choose 5SGXEB5R3F40I3L?

The 5SGXEB5R3F40I3L positions itself as a high‑capacity Stratix V GX FPGA option for designs that require extensive logic, significant embedded memory, and large I/O count within a compact FBGA package. Its industrial temperature rating and RoHS compliance make it suitable for long‑lifecycle, fielded systems where environmental robustness and regulatory adherence matter.

Engineers building complex digital systems, industrial controllers, or multi‑interface communication platforms can leverage this device to consolidate functions, simplify board architecture, and scale design capability within a single, high‑density FPGA.

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