5SGXEB5R3F40I3N

The 5SGXEB5R3F40I3N is an Intel Stratix® V GX field programmable gate array (FPGA) supplied in a 1517-ball FBGA (40×40) package. It delivers a high-density fabric with 490,000 logic elements and approximately 42 Mbits of on-chip RAM, targeting industrial embedded designs that require large programmable logic capacity and substantial embedded memory.

With 432 user I/Os, surface-mount packaging, and an industrial operating range, this device is positioned for applications that need significant I/O connectivity, high logic density, and reliable operation across –40°C to 100°C.

Key Features

• High Logic Density  490,000 logic elements provide extensive programmable fabric for complex logic, datapath, and control implementations.
• Significant Embedded Memory  Approximately 42 Mbits of on-chip RAM supports data buffering, large FIFOs, and memory-intensive functions without relying solely on external memory.
• Extensive I/O  432 user I/O pins enable broad peripheral interfacing, parallel buses, and high-pin-count designs.
• Industrial Temperature Range  Rated for operation from –40°C to 100°C to meet demanding environmental conditions in industrial systems.
• Low Voltage Core  Operates with a core supply range of 820 mV to 880 mV, suitable for designs optimized for modern low-voltage FPGA cores.
• Package and Mounting  1517-FBGA (40×40) surface-mount package for compact board-level integration and high pin count routing.
• Compliance  RoHS-compliant device for regulatory and environmental conformity.

Typical Applications

• Industrial Control  Large logic capacity and wide temperature range make this FPGA suitable for motion control, PLC extensions, and complex automation logic.
• Communications Infrastructure  High logic density and abundant I/O support protocol processing, packet handling, and custom forwarding engines in network equipment.
• Data Acquisition and Processing  On-chip memory and plentiful logic elements support high-throughput data buffering, preprocessing, and real-time signal conditioning.
• Custom Compute and Acceleration  Large programmable fabric enables implementation of hardware accelerators, DSP pipelines, and specialized compute kernels.

Unique Advantages

• Large Programmable Fabric: 490,000 logic elements allow consolidation of multiple functions into a single device, reducing board count and system complexity.
• On-Chip Memory Capacity: Approximately 42 Mbits of embedded RAM reduces dependence on external memory for latency-sensitive buffers and FIFOs.
• High I/O Count: 432 user I/Os provide flexibility for diverse interface standards and parallel connections without sacrificing routing options.
• Industrial Reliability: Specified operation from –40°C to 100°C supports robust performance in harsh or temperature-variable environments.
• Compact, High-Pin Package: 1517-FBGA (40×40) surface-mount package balances high pin count with compact PCB footprint for dense designs.
• Regulatory Compliance: RoHS compliance simplifies adoption in regulated product assemblies and supply chains.

Why Choose 5SGXEB5R3F40I3N?

The 5SGXEB5R3F40I3N combines a very high logic element count, substantial on-chip memory, and a broad complement of I/Os in an industrial-grade FBGA package. It is well suited to engineers building complex embedded systems, communications hardware, and data-processing platforms that require scalable programmable logic and robust environmental performance.

Backed by Intel manufacturing and available documentation, this Stratix® V GX device provides a route to consolidate functionality, reduce external components, and support long-life industrial deployments where capacity and reliability are primary concerns.

Request a quote or submit an inquiry to learn about availability, pricing, and lead time for the 5SGXEB5R3F40I3N. Our team can provide support for procurement and integration planning.