5SGXEB5R3F40I4N

The 5SGXEB5R3F40I4N is a high-density Stratix® V GX field programmable gate array (FPGA) in a 1517‑FBGA (40×40) package designed for industrial environments. With approximately 490,000 logic elements, roughly 42 Mbits of embedded memory and 432 I/Os, this device targets complex digital processing, high-channel I/O integration, and industrial system applications that require robust temperature and supply tolerances.

Key Features

• Core Logic  Approximately 490,000 logic elements provide the density required for large-scale digital designs and complex custom logic implementations.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory for many designs.
• I/O Capacity  432 general-purpose I/Os enable high channel counts and flexible interfacing to peripherals, memory, and board-level signals.
• Power  Core supply range of 820 mV to 880 mV, suitable for systems designed around low-voltage FPGA core power rails.
• Package & Mounting  1517‑FBGA (40×40) package in a surface-mount form factor simplifies board-level integration for compact, high-density designs.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation, supporting deployment in industrial and other temperature-demanding environments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Industrial Control & Automation  High logic density and industrial temperature rating suit complex control algorithms, motor drive logic, and real-time processing in factory equipment.
• High‑Channel I/O Systems  432 I/Os enable aggregation and management of large numbers of sensor, actuator, or interface signals on a single device.
• Data Processing & Acceleration  Large logic and embedded memory resources support custom datapath implementations, parallel processing, and hardware acceleration tasks.
• Communications Infrastructure  Use the device where dense programmable logic and substantial on-chip memory are needed for protocol handling, packet processing, or interface bridging.

Unique Advantages

• High Logic Capacity:  Approximately 490,000 logic elements let you implement large, complex designs without immediate partitioning across multiple devices.
• Generous On‑Chip Memory:  Roughly 42 Mbits of embedded RAM reduces dependence on external memory and lowers system BOM and latency for buffering and state storage.
• Extensive I/O Count:  432 I/Os provide flexibility for dense board-level connectivity and reduce the need for additional interface components.
• Industrial‑Grade Operation:  Rated from −40 °C to 100 °C for reliable performance in temperature-challenging deployments.
• Compact, Surface‑Mount Package:  1517‑FBGA (40×40) packaging enables high-density PCB layouts while supporting standard surface-mount assembly processes.
• Regulatory Readiness:  RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose 5SGXEB5R3F40I4N?

The 5SGXEB5R3F40I4N combines high logic density, substantial embedded memory and a large I/O count in an industrial-temperature, surface-mount FBGA package—making it a solid choice for designers building complex digital systems that must operate reliably across wide temperature ranges. It is well suited to applications that demand on‑device resources for processing, buffering, and extensive external interfacing while keeping board space and external component count under control.

For teams focused on scalable, robust FPGA-based designs, this device offers a compelling balance of integration and environmental tolerance, helping shorten system design cycles and simplify BOMs.

If you would like pricing, availability, or to request a quote for 5SGXEB5R3F40I4N, please submit a parts inquiry or request a quote today.