5SGXEB5R3F43C2L

The 5SGXEB5R3F43C2L is a Stratix® V GX field-programmable gate array (FPGA) IC by Intel. It delivers high logic density and on-chip memory in a high-pin-count FCBGA package, designed for commercial-temperature applications that demand large programmable logic capacity and extensive I/O connectivity. With a broad logic element count, substantial embedded RAM, and a 600-pin I/O footprint, this device targets designs that require integration of complex digital functions into a single FPGA.

Key Features

• Core Logic  Approximately 490,000 logic elements supported on the device, enabling implementation of large, complex digital designs.
• Logic Block Count  185,000 logic blocks (reported device count) to structure and partition designs efficiently.
• Embedded Memory  Approximately 42 Mbits of total on-chip RAM for buffering, lookup tables, and data storage within the FPGA fabric.
• High I/O Count  600 I/Os to support extensive peripheral, bus, and multi-channel interfacing directly from the device.
• Package  1760-ball FCBGA package (1760-FCBGA, 42.5 × 42.5 mm) optimized for high-pin-density system integration and surface-mount board assembly.
• Power and Supply  Specified core voltage supply range of 820 mV to 880 mV for the device core rails.
• Operating Range & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Mounting & Compliance  Surface-mount package; RoHS compliant.

Typical Applications

• High-density digital processing  Implement large-scale datapaths, state machines, and algorithm acceleration using the device’s extensive logic and on-chip RAM.
• Multi-interface systems  Deploy designs that require many parallel and serial interfaces by leveraging the 600 I/O pins for direct connections to peripherals and sub-systems.
• Embedded system consolidation  Integrate multiple functions into a single FPGA to reduce BOM and simplify board-level routing with the high logic element count and dense FCBGA package.

Unique Advantages

• High programmable capacity: The large logic element count enables implementation of complex, feature-rich designs without immediate need for multiple devices.
• Substantial on-chip RAM: Approximately 42 Mbits of embedded memory supports sizable buffering and storage requirements directly inside the FPGA fabric.
• Extensive external connectivity: 600 I/Os provide flexibility for dense peripheral interfacing and system-level integration.
• High-density package: The 1760-FCBGA (42.5 × 42.5 mm) package concentrates pins for high-bandwidth board designs while maintaining a surface-mount footprint.
• Commercial temperature rating: Rated for operation from 0 °C to 85 °C for deployment in commercial-environment systems.
• Regulatory compliance: RoHS-compliant construction supports environmental regulatory needs.

Why Choose 5SGXEB5R3F43C2L?

The 5SGXEB5R3F43C2L provides a balanced combination of high logic density, significant on-chip RAM, and broad I/O availability in a single commercial-grade Stratix V GX FPGA. Its 1760-ball FCBGA package and surface-mount form factor make it suitable for compact, high-pin-count board designs where consolidating complex digital functions into one device reduces system complexity.

This device is well suited for development teams and OEMs designing advanced digital systems that require scalable logic resources, integrated memory, and plentiful I/O while operating within commercial temperature ranges. Its specifications support long-term deployment in commercial products where integration density and maintainable power rails are key design drivers.

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