5SGXEB5R3F43C2N

The 5SGXEB5R3F43C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 1760-ball FCBGA package. It delivers high logic capacity, substantial embedded RAM, and extensive I/O in a commercial-temperature, surface-mount package.

Targeted at high-performance digital designs, the device is suitable for applications that require large numbers of logic elements, significant on-chip memory, and dense I/O connectivity while operating from a low-voltage core supply.

Key Features

• Logic Capacity — Approximately 490,000 logic elements suitable for complex digital designs and heavy parallel processing.
• Embedded Memory — Approximately 42 Mbits of on-chip RAM (41,984,000 bits) to support large buffers, FIFOs, and state storage.
• I/O Density — 600 I/O pins to support rich peripheral, board-level, and mezzanine connectivity.
• Package — 1760-FCBGA (42.5 × 42.5 mm) surface-mount package for compact, high-density board implementations.
• Power/Core Voltage — Core supply range from 870 mV to 930 mV for low-voltage core operation.
• Temperature Grade — Commercial grade with an operating range of 0 °C to 85 °C for standard commercial deployments.
• Environmental Compliance — RoHS compliant.
• Series Transceiver Options (series-level) — Stratix V GX devices are documented in the series datasheet with transceiver speed grades available up to 14.1 Gbps (series-level information).

Typical Applications

• High-speed Data Processing — Use the large logic array and embedded RAM for packet processing, signal processing, and complex data-plane tasks.
• Telecommunications and Networking — High I/O count and series-level transceiver options make the device suitable for line-card logic, switching fabrics, and protocol processing.
• Video and Imaging — Leverage extensive logic and on-chip memory for real-time video pipelines, frame buffering, and format conversion.
• Prototyping and IP Integration — Dense logic and memory resources support system-level prototyping and integration of multiple IP cores on a single device.

Unique Advantages

• High logic density: Approximately 490,000 logic elements reduce the need for multiple devices and simplify system partitioning.
• Substantial on-chip memory: Approximately 42 Mbits of embedded RAM provides local storage for high-throughput buffering and state machines.
• Extensive I/O: 600 I/O pins enable flexible interfacing to high-pin-count peripherals and multi-lane board-level connections.
• Compact FCBGA package: 1760-ball FCBGA (42.5 × 42.5 mm) balances thermal and routing considerations for dense board designs.
• Low-voltage core operation: 870–930 mV supply range supports modern low-voltage FPGA core requirements.
• Commercial temperature rating: 0 °C to 85 °C aligns the device to a wide range of commercial applications.

Why Choose 5SGXEB5R3F43C2N?

The 5SGXEB5R3F43C2N combines large logic capacity, significant embedded RAM, and abundant I/O in a single Stratix V GX-class FCBGA package, making it well suited for demanding commercial designs that require on-chip integration and scalability. Its low-voltage core and commercial temperature rating align with modern board-level power and environmental requirements.

Designed for engineers who need a high-density FPGA platform with series-level transceiver capability and proven device documentation, this part supports complex system integration while maintaining compliance with RoHS requirements.

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