5SGXEB5R3F43C3N

The 5SGXEB5R3F43C3N is a Stratix® V GX field programmable gate array (FPGA) device designed for high-density, I/O-rich digital designs. It combines a large logic fabric with significant on-chip RAM and a high I/O count in a 1760-pin FCBGA surface-mount package suitable for commercial-temperature applications.

Engineered for systems that require large amounts of programmable logic, on-chip memory, and extensive external interfacing, this device delivers a balance of integration and board-level scalability while operating from a low-voltage core supply.

Key Features

• Core logic capacity — 490,000 logic elements to implement large, complex digital designs and custom compute pipelines.
• Embedded memory — approximately 42 Mbits of total on-chip RAM for buffering, look-up tables, and state storage.
• I/O density — 600 available I/O pins to support wide parallel buses, multiple interfaces, and mixed-signal front-ends.
• Power and voltage — specified core supply range of 820 mV to 880 mV to match targeted low-voltage system designs.
• Package and mounting — 1760-FCBGA (42.5 × 42.5 mm) package, surface-mount mounting type for PCB integration in space-constrained boards.
• Operating range — commercial temperature grade with operating temperature from 0 °C to 85 °C.
• Regulatory compliance — RoHS compliant for environmental and assembly compatibility.

Typical Applications

• High-density custom logic — implement complex state machines, accelerators, and custom datapaths using the 490,000 logic elements.
• Memory-intensive algorithms — leverage approximately 42 Mbits of embedded RAM for buffering, packet queues, or on-chip data storage.
• I/O-heavy systems — support wide external buses, multi-channel interfaces, and sensor arrays with 600 I/O pins.
• Board-level integration — surface-mount 1760-FCBGA package enables compact PCB designs requiring high pin count and routing density.

Unique Advantages

• Large programmable fabric — 490,000 logic elements provide the capacity to consolidate multiple functions into a single device, reducing component count.
• Substantial on-chip RAM — approximately 42 Mbits of embedded memory reduces dependence on external RAM for many buffering and state-storage needs.
• High I/O availability — 600 I/O pins simplify system integration when connecting numerous peripherals or parallel interfaces.
• Compact high-pin-count package — 1760-FCBGA (42.5 × 42.5 mm) balances pin density and board area for complex system boards.
• Low-voltage core — specified 820 mV–880 mV supply enables designs targeting lower power-core domains.
• Commercial-grade readiness — rated for 0 °C to 85 °C and RoHS compliant to meet common assembly and operating requirements.

Why Choose 5SGXEB5R3F43C3N?

5SGXEB5R3F43C3N positions itself as a high-capacity Stratix V GX FPGA suitable for designs that require a large logic fabric, significant embedded memory, and extensive I/O connectivity in a single, surface-mount package. Its combination of 490,000 logic elements and approximately 42 Mbits of on-chip RAM supports consolidation of complex functionality onto one device, while the 1760-FCBGA package keeps the solution board-friendly.

This device is a fit for engineering teams and procurement looking for a commercial-temperature, RoHS-compliant FPGA option that provides scalability for advanced digital, memory, and I/O-centric designs, backed by the Stratix V device family documentation and specifications.

Request a quote or submit an inquiry today to discuss pricing and availability for 5SGXEB5R3F43C3N. Our team can provide lead-time and ordering details tailored to your project needs.