5SGXEB5R3F43C3G

The 5SGXEB5R3F43C3G is an Intel Stratix® V GX field-programmable gate array (FPGA) in a 1760-ball FCBGA package. This commercial-grade, surface-mount device provides a high-density programmable fabric with a large I/O count and substantial on-chip memory for complex digital designs.

With 490,000 logic elements, approximately 42 Mbits of embedded memory, and up to 600 I/O pins, this Stratix V GX device is targeted at high-performance systems requiring dense logic, extensive I/O connectivity, and low-voltage core operation (820 mV–880 mV).

Key Features

• Core Logic  490,000 logic elements (LEs) for large-scale programmable logic and complex system integration.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM to support data buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Density  Up to 600 user I/O pins to accommodate wide parallel interfaces and multiple high-speed connectivity channels.
• Package & Mounting  1760-BBGA (1760-FCBGA) package, supplier package size 42.5 × 42.5 mm; surface-mount assembly.
• Power & Voltage  Core voltage supply range: 820 mV to 880 mV to match low-voltage system designs.
• Operating Range  Commercial temperature grade with operating temperature from 0 °C to 85 °C.
• Standards & Compliance  RoHS compliant.
• Stratix V GX Family Context  As part of the Stratix V GX family, the series documentation includes transceiver speed grade information and detailed electrical characteristics for system-level design and power planning.

Typical Applications

• High‑speed communications  Large I/O and Stratix V GX family transceiver capabilities make the device suitable for networking and communications subsystems requiring multi-channel connectivity.
• Data processing and acceleration  High logic density and substantial embedded memory support compute-heavy data-paths, streaming processors, and protocol offload engines.
• Test & measurement systems  Wide I/O and flexible fabric enable custom digital front ends, real-time signal processing, and multi-channel instrumentation.

Unique Advantages

• High integration density: 490,000 logic elements and approximately 42 Mbits of RAM reduce the need for external logic and memory, simplifying BOM and board routing.
• Extensive I/O capability: Up to 600 I/O pins allow direct interfacing to many peripherals and high-pin-count subsystems without dense connector wiring or multiplexing.
• Low-voltage core operation: 820 mV–880 mV core supply supports modern low-voltage system architectures while enabling efficient power planning.
• Commercial-grade thermal envelope: Rated for 0 °C to 85 °C operation to meet standard commercial deployment requirements.
• RoHS compliant: Conforms to RoHS directives for environmentally responsible designs.

Why Choose 5SGXEB5R3F43C3G?

The 5SGXEB5R3F43C3G combines a high count of logic elements and embedded memory with broad I/O capability and a large FCBGA package to support demanding, densely integrated FPGA designs. Its commercial-grade specification and documented Stratix V GX family electrical characteristics make it a practical choice for teams designing high-performance communication, processing, and test systems that require scalable programmable logic.

Engineers and procurement teams seeking a high-density, low-voltage FPGA with extensive I/O and on-chip memory will find this device suited to complex system integration and rapid prototyping within commercial operating environments.

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