5SGXEB5R3F43C2LG

The 5SGXEB5R3F43C2LG is an Intel Stratix® V GX field programmable gate array supplied in a 1760-FCBGA package. It delivers very high logic density, substantial on-chip memory, and an extensive I/O count for demanding, I/O‑intensive FPGA designs.

As a Stratix V GX device, the series supports high‑speed transceiver operation (GX channel rates shown in the series datasheet up to 14.1 Gbps) and is offered in commercial temperature grade with verified electrical characteristics and operating requirements in the datasheet.

Key Features

• Logic Capacity  Approximately 490,000 logic elements for complex, high‑density digital implementations.
• Embedded Memory  Approximately 42 Mbits of on‑chip RAM to support large data buffers, FIFOs, and local storage.
• I/O Resources  600 I/O pins to support dense external interfacing and multi‑channel system designs.
• Package & Mounting  1760‑FCBGA package (42.5 × 42.5 mm) with surface‑mount mounting for robust board integration.
• Power Supply  Core supply specified at 0.820 V to 0.880 V to match device electrical requirements.
• Temperature Grade  Commercial grade operation from 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High‑density digital processing  Leverage ~490,000 logic elements and ~42 Mbits of embedded memory for compute‑intensive FPGA algorithms and custom accelerators.
• I/O‑intensive systems  600 I/Os enable aggregation of multiple external interfaces, sensors, or parallel data lanes in a single device.
• High‑speed serial communications  Stratix V GX series transceiver capabilities (series datasheet lists GX channel rates up to 14.1 Gbps) support high‑bandwidth link implementations.

Unique Advantages

• High logic density: Large logic element count allows consolidation of complex system functions into one FPGA, reducing board‑level component count.
• Substantial on‑chip memory: Approximately 42 Mbits of RAM provides local storage for data buffering and state machines, minimizing external memory dependence.
• Extensive I/O: 600 I/Os support wide parallel buses, multi‑lane interfaces, and dense port counts for flexible system connectivity.
• Compact FCBGA package: 1760‑FCBGA (42.5 × 42.5 mm) balances I/O density and board area for streamlined PCB layout.
• Low‑voltage core: Core supply range of 0.820–0.880 V aligns with the device’s electrical operating conditions to optimize power delivery design.
• Regulatory compliance: RoHS compliance helps meet environmental requirements for commercial products.

Why Choose 5SGXEB5R3F43C2LG?

The 5SGXEB5R3F43C2LG offers a combination of high logic capacity, abundant embedded memory, and a large I/O complement in a single commercial‑grade Stratix V GX device. These characteristics make it suitable for engineers designing complex FPGA systems that require consolidation of logic, substantial on‑chip storage, and dense external interfacing within a surface‑mount FCBGA footprint.

Backed by Intel’s Stratix V device family electrical and switching specifications, this device is a strong option for teams seeking a scalable, high‑performance FPGA platform with defined operating conditions and documented transceiver capability in the series datasheet.

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