5SGXEB5R3F43C2G

The 5SGXEB5R3F43C2G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC in a 1760-FCBGA package designed for commercial-temperature applications. It delivers very-high logic density, substantial on-chip memory, and a large I/O count for complex digital designs that require extensive routing and integration.

This device is targeted at designs that need dense programmable logic, significant embedded RAM, and broad I/O capacity—providing a foundation for high-integration system designs where on-chip resources reduce external component count.

Key Features

• Core Logic  Approximately 490,000 logic elements (logic cells) to implement large-scale digital functions and complex algorithms.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM to support buffering, packet processing, and memory-intensive functions without immediate external memory dependencies.
• I/O Capacity  600 user I/Os to accommodate wide parallel interfaces, multiple peripherals, or high-pin-count system interfaces.
• Package & Mounting  1760-FCBGA (42.5×42.5 mm) package, surface-mount, suitable for compact, high-density board designs.
• Power  Core voltage supply range of 870 mV to 930 mV, enabling low-voltage core operation consistent with Stratix V device requirements.
• Operating Temperature  Commercial grade operation from 0 °C to 85 °C for standard commercial-environment deployments.
• Regulatory & Compliance  RoHS-compliant manufacturing status.

Typical Applications

• High-density digital systems  Use the large logic capacity to consolidate complex state machines, signal processing pipelines, and custom accelerators onto a single device.
• Memory-intensive processing  Leverage approximately 42 Mbits of embedded RAM for buffering, on-chip caches, and data-path storage to reduce external memory traffic.
• Wide-interface or multi-I/O platforms  Employ the 600 I/Os for large parallel buses, multi-lane interfaces, and extensive sensor or peripheral connectivity.
• Compact system integration  The 1760-FCBGA package supports high integration density for space-constrained boards requiring significant programmable resources.

Unique Advantages

• High logic density: Approximately 490,000 logic elements provide the capacity to implement large, integrated system functions on a single FPGA.
• Substantial embedded memory: Around 42 Mbits of on-chip RAM reduces the need for immediate external memory, simplifying board-level design and improving latency for local data access.
• Large I/O complement: 600 I/Os enable flexible connectivity options for parallel interfaces, high-pin-count peripherals, and wide data paths.
• Compact FCBGA footprint: The 1760-FCBGA (42.5×42.5 mm) package offers high integration density for modern boards while supporting surface-mount assembly.
• Commercial temperature rating: Rated 0 °C to 85 °C to match typical commercial-environment deployments and system requirements.
• RoHS compliant: Manufactured to meet RoHS standards for material compliance.

Why Choose 5SGXEB5R3F43C2G?

The 5SGXEB5R3F43C2G positions itself as a high-capacity Stratix V GX FPGA option for designers who need extensive programmable logic, significant embedded RAM, and a large number of I/Os in a compact FCBGA package. Its combination of approximately 490,000 logic elements, roughly 42 Mbits of on-chip memory, and 600 I/Os supports consolidation of complex functions and high-integration system architectures while maintaining a commercial temperature profile.

For projects focused on reducing external components, supporting dense logic and memory requirements, and enabling broad I/O connectivity, this device provides a clear, verifiable specification set and is documented within the Stratix V device datasheet for detailed electrical and operating characteristics.

If you would like pricing, availability, or a formal quote for 5SGXEB5R3F43C2G, submit a quote request or contact our sales channel to request a quote today.