5SGXEB5R2F43C3

The 5SGXEB5R2F43C3 is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) in a 1760-BBGA FCBGA package. The device provides a high density of programmable logic, on-chip memory, and I/O in a surface-mount FCBGA footprint suitable for commercial-temperature designs.

Key device specifications include 490,000 logic elements, approximately 42 Mbits of embedded RAM, 600 user I/Os, a core supply range of 820 mV to 880 mV, and commercial operating temperature from 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic  490,000 logic elements provide a high-capacity programmable fabric for complex digital designs.
• Embedded Memory  Approximately 42 Mbits of on-chip RAM to support deep buffering, state storage, and memory-intensive algorithms.
• I/O Density  600 I/O pins enable large, flexible external interfacing for parallel buses, peripherals, and board-level connectivity.
• Package & Mounting  1760-BBGA (1760-FCBGA) surface-mount package; supplier device package dimension listed as 1760-FCBGA (42.5×42.5 mm).
• Power  Core voltage supply specified between 820 mV and 880 mV to match system power-rail requirements.
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant.
• Series Characteristics (datasheet)  The Stratix V GX family datasheet documents GX channel transceiver speed grades up to 14.1 Gbps for the series (see device family datasheet for details).

Typical Applications

• High-density programmable logic  Large logic capacity and on-chip memory make the device suitable for designs that require substantial programmable resources.
• Dense I/O interfacing  With 600 I/Os, the device supports applications needing extensive external connectivity and parallel interfaces.
• Commercial embedded systems  Commercial temperature rating and FCBGA packaging suit a wide range of commercial embedded designs.

Unique Advantages

• High logic capacity: 490,000 logic elements enable implementation of complex, large-scale logic functions on a single device.
• Substantial on-chip memory: Approximately 42 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O count: 600 I/Os provide flexibility for system-level integration and high-pin-count interfaces.
• Compact FCBGA package: 1760-FCBGA (42.5×42.5 mm) balances high-pin count with a board-level footprint suitable for surface-mount assembly.
• Commercial temperature suitability: Rated for 0 °C to 85 °C to meet typical commercial application environments.
• Regulatory compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose 5SGXEB5R2F43C3?

The 5SGXEB5R2F43C3 delivers a combination of large programmable logic capacity, significant embedded memory, and extensive I/O in a single commercial-grade FCBGA package. Its specifications make it well suited to applications that require dense logic, on-chip RAM, and high pin count within a surface-mount form factor.

As a member of the Stratix V GX family, the device aligns with the series-level electrical and transceiver characteristics documented in the Stratix V device datasheet, providing a clear specification baseline for system designers seeking verified device-level parameters.

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