5SGXEB5R2F43C2L
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 41984000 490000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 129 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 41984000 |
Overview of 5SGXEB5R2F43C2L – Stratix® V GX FPGA, 490000 logic elements, 1760‑FCBGA
The 5SGXEB5R2F43C2L is a Stratix® V GX field programmable gate array (FPGA) in a 1760‑ball FCBGA package. This commercial‑grade device integrates high logic density, abundant I/O, and substantial on‑chip memory for complex digital systems and high‑performance embedded designs. As a member of the Stratix V GX family (series documentation references GX channel transceiver options up to 14.1 Gbps), it targets applications that require large programmable fabric, extensive I/O, and tight power/voltage operating windows.
Key Features
- High Logic Density — 490000 logic elements to implement large custom logic, control engines, and data path functions.
- Embedded Memory — Approximately 42 Mbits of on‑chip RAM for FIFOs, buffers, and state storage to support complex algorithms and high‑throughput data handling.
- Rich I/O Count — 600 I/O pins for extensive peripheral, interface, and mezzanine connectivity in dense systems.
- Power and Core Voltage — Core supply range specified from 820 mV to 880 mV, enabling precise power budgeting and regulator selection.
- Package and Mounting — 1760‑FCBGA (42.5 × 42.5 mm) surface‑mount package for high‑density board integration.
- Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial environments.
- Standards Compliance — RoHS compliant, supporting regulatory and manufacturing requirements for lead‑free assembly.
Typical Applications
- High‑Performance Networking — Implement packet processing, protocol offload, and interface bridging using large logic capacity and abundant I/O.
- Telecommunications Equipment — Use on‑chip memory and logic for framing, buffering, and custom signal processing functions in communication systems.
- Data Center and Accelerator Boards — Deploy complex datapath logic and buffering for processing acceleration and FPGA‑based co‑processing.
- Industrial Control and Instrumentation — Leverage extensive I/O and programmable fabric to integrate control logic, data acquisition, and custom interfaces in commercial industrial designs.
Unique Advantages
- Large Programmable Fabric: 490000 logic elements provide the headroom needed for multi‑function designs and deep pipelines without immediate migration.
- Significant On‑Chip Memory: Approximately 42 Mbits of embedded RAM reduces external memory dependence and streamlines board design.
- Extensive I/O Accessibility: 600 I/O pins enable direct connection to many peripherals and high‑density connectors, simplifying system integration.
- Compact, Robust Packaging: 1760‑FCBGA (42.5 × 42.5 mm) supports high pin count in a manufacturable surface‑mount form factor for production PCBs.
- Controlled Power Envelope: Narrow core voltage range (820 mV–880 mV) helps with targeted power supply design and stable core operation.
- Commercial Temperature Suitability: Rated 0 °C to 85 °C to match typical commercial and enterprise operating environments.
Why Choose 5SGXEB5R2F43C2L?
This Stratix V GX device combines high logic capacity, substantial embedded memory, and a large I/O count in a production‑ready FCBGA package. It is well suited for engineers developing complex, compute‑intensive FPGA designs in commercial applications that require dense programmable fabric and significant on‑chip buffering. The device’s defined core voltage range and RoHS compliance simplify power and manufacturing planning while the Stratix V GX family pedigree provides series‑level features documented in the device datasheet.
Request a quote or submit a product inquiry to evaluate 5SGXEB5R2F43C2L for your next high‑density FPGA design.

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