5SGXEB5R2F43C2N

The 5SGXEB5R2F43C2N is a Stratix® V GX family FPGA from Intel, delivering a large programmable fabric and dense on‑chip memory in a single FCBGA package. It is a commercial‑grade device designed for applications that require high logic capacity, extensive I/O and a defined core supply voltage range.

This device is suitable for designs that demand significant embedded memory, high I/O counts, and the integration of complex digital logic within a compact 1760‑ball FCBGA footprint.

Key Features

• Logic Capacity — Approximately 490,000 logic elements to implement large, complex digital designs.
• Embedded Memory — Approximately 42 Mbits of on‑chip RAM for buffering, FIFOs and local storage.
• I/O Resources — 600 I/O pins to support extensive external connectivity and parallel interfaces.
• Package & Mounting — 1760‑FCBGA package (42.5 × 42.5 mm) in a surface‑mount ball grid array for compact board integration.
• Power Supply — Core supply voltage range specified at 870 mV to 930 mV for defined power budgeting at the core level.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation suitable for commercial applications.
• RoHS Compliant — Manufactured to meet RoHS environmental requirements.
• Stratix V GX Series Capabilities — Series datasheet documents GX transceiver speed grade options (series capability includes GX channel speeds up to 14.1 Gbps depending on speed grade).

Typical Applications

• High‑density digital systems — Implement complex state machines, pipelined datapaths and large FPGA algorithms using the device's extensive logic capacity and embedded memory.
• High‑I/O interfacing — Drive parallel buses, wide data paths and multiple external peripherals using 600 I/O pins to reduce external interfacing components.
• High‑speed serial systems — Leverage the Stratix V GX series transceiver capabilities (series documented up to 14.1 Gbps) for designs that integrate high‑speed serial links, subject to device speed grade selection.

Unique Advantages

• High integration density: Large logic element count and substantial on‑chip RAM allow more functionality to be kept on‑chip, simplifying board design and reducing external memory needs.
• Extensive external connectivity: 600 I/Os provide flexibility for complex multi‑interface systems without extensive external multiplexing.
• Compact system form factor: 1760‑FCBGA (42.5 × 42.5 mm) package enables high pin count in a compact footprint for space‑constrained boards.
• Defined power envelope: Specified core supply range (870 mV–930 mV) helps with predictable power‑rail design and thermal planning.
• Commercial grade and RoHS compliance: Designed for commercial temperature ranges and manufactured to RoHS standards for regulatory alignment.

Why Choose 5SGXEB5R2F43C2N?

The 5SGXEB5R2F43C2N positions itself as a high‑capacity Stratix V GX FPGA option for commercial applications that require substantial programmable logic, significant embedded memory and a high I/O count within a compact FCBGA package. Its defined core voltage range and commercial temperature rating make it suitable for production systems where predictable power and thermal behavior are important.

This device is well suited to engineers building complex digital systems, high‑throughput interfaces or multi‑protocol platforms who require a balance of logic density, on‑chip RAM and connectivity in a standardized Stratix V GX form factor.

Request a quote or submit an inquiry for pricing and availability of the 5SGXEB5R2F43C2N to evaluate it for your next high‑density FPGA design.