5SGXEB5R2F43C1N

IC FPGA 600 I/O 1760FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 41984000 490000 1760-BBGA, FCBGA

Quantity 1,656 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1760-FCBGA (42.5x42.5)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits41984000

Overview of 5SGXEB5R2F43C1N – Stratix® V GX FPGA, 1760-FCBGA, 600 I/O

The 5SGXEB5R2F43C1N is an Intel Stratix V GX field-programmable gate array supplied in a 1760-FCBGA package. It provides a high logic capacity device with substantial embedded memory and a large I/O count for commercial-grade applications.

With 490,000 logic elements, approximately 42 Mbits of on-chip RAM, and 600 user I/Os, this device is suited to designs that require dense logic integration, significant embedded memory, and broad external connectivity while operating within a commercial temperature range.

Key Features

  • Logic Capacity 490,000 logic elements (cells) to implement complex digital designs and large-scale logic functions.
  • Embedded Memory Approximately 42 Mbits of on-chip RAM for buffering, lookup tables, and data storage inside the FPGA fabric.
  • High I/O Count 600 user I/Os to support dense external interfaces and parallel connectivity to peripherals and mezzanine modules.
  • Core Voltage Low-voltage core supply range: 870 mV to 930 mV.
  • Package and Mounting 1760-FCBGA (42.5 × 42.5 mm) surface-mount package for high-density system integration.
  • Commercial Temperature Grade Rated for operation from 0 °C to 85 °C, suitable for commercial electronic systems.
  • Standards Compliance RoHS compliant for environmental and manufacturing process compatibility.

Typical Applications

  • High-density signal processing — Large logic capacity and substantial embedded RAM enable implementation of complex DSP, packet processing, and real-time data pipelines.
  • Network and communications — High I/O count supports multi-channel interfaces, parallel links, and board-level connectivity for communications equipment.
  • Embedded system acceleration — Use as a hardware accelerator to offload compute-intensive tasks where on-chip memory and logic density improve throughput.
  • Prototyping and platform development — Commercial-grade FPGA platform for validating large-scale digital designs and system architectures.

Unique Advantages

  • Large integrated logic resource: 490,000 logic elements reduce the need for multiple devices and simplify system partitioning.
  • Substantial embedded memory: Approximately 42 Mbits of on-chip RAM supports deep buffering and state storage without external memory in many designs.
  • Extensive I/O connectivity: 600 user I/Os enable flexible interfacing to a wide range of peripherals and high-pin-count board designs.
  • Compact, high-density package: 1760-FCBGA (42.5 × 42.5 mm) provides a balance of pin count and board-area efficiency for dense system layouts.
  • Commercially rated: Designed for operation across a 0 °C to 85 °C range to meet typical commercial product requirements.
  • RoHS compliant: Facilitates environmentally conscious manufacturing and global shipment requirements.

Why Choose 5SGXEB5R2F43C1N?

The 5SGXEB5R2F43C1N combines a high logic-element count, significant on-chip RAM, and a large I/O complement in a single commercial-grade Stratix V GX package. This combination suits engineers building complex digital systems that require dense logic implementation, internal memory, and broad external connectivity while maintaining a compact board footprint.

As part of the Intel Stratix V GX family and supplied in a 1760-FCBGA surface-mount package, this device is appropriate for development and production designs where commercial temperature operation, RoHS compliance, and a low-voltage core are required.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXEB5R2F43C1N. Provide your quantity and any required delivery details to begin the procurement process.

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