5SGXEB5R2F43C1N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 41984000 490000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 1,656 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-FCBGA (42.5x42.5) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 41984000 |
Overview of 5SGXEB5R2F43C1N – Stratix® V GX FPGA, 1760-FCBGA, 600 I/O
The 5SGXEB5R2F43C1N is an Intel Stratix V GX field-programmable gate array supplied in a 1760-FCBGA package. It provides a high logic capacity device with substantial embedded memory and a large I/O count for commercial-grade applications.
With 490,000 logic elements, approximately 42 Mbits of on-chip RAM, and 600 user I/Os, this device is suited to designs that require dense logic integration, significant embedded memory, and broad external connectivity while operating within a commercial temperature range.
Key Features
- Logic Capacity 490,000 logic elements (cells) to implement complex digital designs and large-scale logic functions.
- Embedded Memory Approximately 42 Mbits of on-chip RAM for buffering, lookup tables, and data storage inside the FPGA fabric.
- High I/O Count 600 user I/Os to support dense external interfaces and parallel connectivity to peripherals and mezzanine modules.
- Core Voltage Low-voltage core supply range: 870 mV to 930 mV.
- Package and Mounting 1760-FCBGA (42.5 × 42.5 mm) surface-mount package for high-density system integration.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C, suitable for commercial electronic systems.
- Standards Compliance RoHS compliant for environmental and manufacturing process compatibility.
Typical Applications
- High-density signal processing — Large logic capacity and substantial embedded RAM enable implementation of complex DSP, packet processing, and real-time data pipelines.
- Network and communications — High I/O count supports multi-channel interfaces, parallel links, and board-level connectivity for communications equipment.
- Embedded system acceleration — Use as a hardware accelerator to offload compute-intensive tasks where on-chip memory and logic density improve throughput.
- Prototyping and platform development — Commercial-grade FPGA platform for validating large-scale digital designs and system architectures.
Unique Advantages
- Large integrated logic resource: 490,000 logic elements reduce the need for multiple devices and simplify system partitioning.
- Substantial embedded memory: Approximately 42 Mbits of on-chip RAM supports deep buffering and state storage without external memory in many designs.
- Extensive I/O connectivity: 600 user I/Os enable flexible interfacing to a wide range of peripherals and high-pin-count board designs.
- Compact, high-density package: 1760-FCBGA (42.5 × 42.5 mm) provides a balance of pin count and board-area efficiency for dense system layouts.
- Commercially rated: Designed for operation across a 0 °C to 85 °C range to meet typical commercial product requirements.
- RoHS compliant: Facilitates environmentally conscious manufacturing and global shipment requirements.
Why Choose 5SGXEB5R2F43C1N?
The 5SGXEB5R2F43C1N combines a high logic-element count, significant on-chip RAM, and a large I/O complement in a single commercial-grade Stratix V GX package. This combination suits engineers building complex digital systems that require dense logic implementation, internal memory, and broad external connectivity while maintaining a compact board footprint.
As part of the Intel Stratix V GX family and supplied in a 1760-FCBGA surface-mount package, this device is appropriate for development and production designs where commercial temperature operation, RoHS compliance, and a low-voltage core are required.
Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXEB5R2F43C1N. Provide your quantity and any required delivery details to begin the procurement process.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018