5SGXMA4H2F35I2

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA

Quantity 634 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4H2F35I2 – Stratix® V GX FPGA IC, 420,000 logic elements, 1152‑FBGA

The 5SGXMA4H2F35I2 is an Intel Stratix V GX family field-programmable gate array supplied in a 1152‑FBGA (35×35) surface-mount package. It pairs a high-density logic fabric with abundant I/O and embedded memory to address bandwidth‑centric and data‑intensive designs.

Built on the Stratix V architecture, the device family includes enhanced core fabric, integrated hard IP blocks and high‑speed transceiver capability. This specific GX device provides a large logic capacity, extensive I/O and industrial operating range for demanding communications and network processing applications.

Key Features

  • Core and Fabric  Stratix V family architecture with a redesigned adaptive logic module and comprehensive fabric clocking network; this device provides 420,000 logic elements for complex logic implementation.
  • Embedded Memory  Approximately 37.9 Mbits of on‑chip RAM (37,888,000 bits) implemented as M20K memory blocks for packet buffers, FIFOs and state storage.
  • Transceivers & I/O  GX family devices include integrated high‑speed transceivers (GX channels) with up to 14.1 Gbps capability and the device exposes 600 I/O pins for broad interface support.
  • DSP and Hard IP  Stratix V devices incorporate variable‑precision DSP resources and embedded hard IP blocks—such as hardened PCIe IP instantiation options—useful for accelerating signal processing and protocol handling.
  • Power Supply  Core operating voltage range specified from 870 mV to 930 mV, enabling integration with regulated core power rails in modern systems.
  • Package & Mounting  Surface‑mount 1152‑BBGA / FCBGA package (supplier package: 1152‑FBGA, 35×35 mm) for high‑density board integration.
  • Operating Range & Compliance  Industrial grade operation from −40 °C to 100 °C and RoHS compliant.

Typical Applications

  • Optical and High‑speed Transport  GX transceiver capability and high logic density make the device suitable for 40G/100G optical transport and backplane interface tasks.
  • Packet Processing & Network Infrastructure  Large on‑chip memory, extensive I/O and abundant logic elements support traffic management, packet parsing and forwarding functions.
  • Network Test and Measurement Equipment  High I/O count and programmable fabric enable protocol test, pattern generation and real‑time data capture in test systems.
  • Communications Equipment  The combination of integrated transceivers, DSP resources and hardened IP makes it suitable for wireline and military communications platforms requiring programmable bandwidth handling.

Unique Advantages

  • High Logic Capacity: 420,000 logic elements support complex, multi‑function designs and large protocol stacks without external glue logic.
  • Substantial On‑Chip Memory: Approximately 37.9 Mbits of embedded RAM reduces dependence on external buffering for low‑latency packet and signal processing.
  • Integrated High‑Speed Transceivers: GX channels with up to 14.1 Gbps capability provide native support for high‑bandwidth serial interfaces.
  • Broad I/O Reach: 600 I/O pins enable multiple parallel interfaces, wide datapaths and extensive control/status signaling on a single device.
  • Industrial Temperature Support: −40 °C to 100 °C rating enables deployment in demanding environmental conditions.
  • Compact, High‑Density Package: 1152‑FBGA (35×35) surface‑mount package simplifies board layout for space‑constrained systems.

Why Choose 5SGXMA4H2F35I2?

The 5SGXMA4H2F35I2 delivers a combination of high logic density, significant embedded memory and integrated GX transceiver capability within a robust industrial temperature envelope. It is positioned for designers building bandwidth‑intensive communications, networking and test equipment who require programmable flexibility alongside hardened IP options and high‑speed serial interfaces.

Choosing this Stratix V GX device gives you a scalable, programmable platform for prototyping and production designs where logic capacity, on‑chip buffering and transceiver performance are primary drivers. Its package, power and temperature specifications support integration into complex, high‑reliability systems.

Request a quote or submit an inquiry to obtain pricing, availability and lead‑time information for the 5SGXMA4H2F35I2 Stratix V GX FPGA.

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