5SGXMA4H2F35I2LG

The 5SGXMA4H2F35I2LG is a Stratix® V GX field-programmable gate array (FPGA) IC designed for high-density programmable logic and integrated transceiver capabilities. It combines a large logic element count, substantial embedded memory, and extensive I/O in a ball-grid array package targeted at industrial-grade applications.

Device documentation for the Stratix V family details electrical, switching, and transceiver characteristics, enabling designers to implement complex digital systems with defined performance and reliability parameters.

Key Features

• Core Density 420,000 logic elements provide capacity for large-scale FPGA implementations and complex logic functions.
• Embedded Memory Approximately 38 Mbits of on-chip RAM (37,888,000 bits) for buffering, look-up tables, and data storage.
• I/O Resources 600 I/O pins for extensive board- and system-level interfacing.
• High-speed Transceivers Stratix V GX transceiver speed grades include options up to 14.1 Gbps per GX channel, as documented in the device series datasheet.
• Power Core supply range of 0.820 V to 0.880 V to match low-voltage system architectures.
• Package & Mounting 1152-BBGA (FCBGA) package; supplier package listed as 1152-FBGA (35×35); surface-mount mounting type.
• Temperature & Grade Industrial-grade device with an operating temperature range of −40°C to 100°C.
• Compliance RoHS compliant.

Typical Applications

• High-speed serial systems Implement serial links using Stratix V GX transceivers with documented channel speed grades up to 14.1 Gbps.
• High-density FPGA processing Deploy large logic designs and FPGA-based data processing that leverage 420,000 logic elements and substantial embedded RAM.
• Complex I/O subsystems Integrate multiple parallel and serial interfaces on a single device using the 600 available I/O pins for system-level connectivity.

Unique Advantages

• High logic capacity: 420,000 logic elements enable implementation of large, integrated FPGA designs without immediate need for multi-FPGA partitioning.
• Substantial on-chip memory: Approximately 38 Mbits of embedded RAM reduces external memory dependency for many buffering and storage needs.
• Extensive I/O count: 600 I/O pins support complex board-level interfacing and multiple peripheral connections.
• Industrial temperature range: Rated from −40°C to 100°C for deployments requiring industrial-grade thermal tolerance.
• Low-voltage core operation: 0.820–0.880 V supply range aligns with modern low-voltage system designs.
• Documented transceiver capability: Series datasheet provides transceiver and I/O timing details to support reliable high-speed link design.

Why Choose 5SGXMA4H2F35I2LG?

The 5SGXMA4H2F35I2LG delivers a combination of high logic density, significant on-chip memory, and broad I/O resources in a surface-mount 1152-BBGA package tailored to industrial-temperature applications. Its documented transceiver and electrical characteristics enable designers to plan and validate high-speed interfaces and complex system logic with defined parameters.

This device is suited to engineering teams and procurement groups developing FPGA-based platforms that require large programmable logic capacity, substantial embedded RAM, and a high count of I/O pins within an industrial operating range.

If you would like pricing, availability, or a formal quote for 5SGXMA4H2F35I2LG, submit a quote request or inquiry including your required quantity and lead-time expectations.