5SGXMA4H2F35I2LN

The 5SGXMA4H2F35I2LN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC designed to deliver high logic density and extensive I/O capability in a compact FCBGA package. It is offered as an industrial-grade device and is documented within the Stratix V device family datasheet covering electrical characteristics, switching behavior, transceiver specifications, and I/O timing.

With a large complement of logic elements, substantial on-chip RAM, and a high I/O count, this device targets demanding digital designs that require integrated programmable logic, embedded memory, and robust thermal and voltage operating margins.

Key Features

• Core Logic  Approximately 420,000 logic elements for implementing complex custom logic and high-density datapaths.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support large buffers, FIFOs, and local data storage.
• I/O Capacity  600 I/Os to enable broad peripheral interfacing and multi-channel connectivity.
• Power  Core supply voltage specified between 820 mV and 880 mV for the device core.
• Package & Mounting  1152-BBGA, FCBGA package (supplier device package listed as 1152-FBGA 35×35) with surface-mount mounting type for compact board integration.
• Temperature & Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C for extended-environment applications.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Leverage the ~420k logic elements and on-chip RAM to implement custom accelerators, complex state machines, and wide datapaths.
• Memory-intensive logic  Use the approximately 37.9 Mbits of embedded memory for buffering, packet processing, and local storage in data-path designs.
• Multi-channel I/O systems  Deploy in applications requiring many external interfaces or parallel channels, enabled by 600 available I/Os.
• Industrial systems  Take advantage of industrial temperature grading (−40 °C to 100 °C) for deployments in demanding environmental conditions.

Unique Advantages

• High logic density: Approximately 420,000 logic elements enable large-scale FPGA implementations without external logic expansion.
• Substantial on-chip memory: Approximately 37.9 Mbits of embedded RAM reduce reliance on external memory for many data buffering and storage needs.
• Extensive I/O count: 600 I/Os provide flexibility for multi-device interfacing, sensors, and high-channel-count systems.
• Industrial temperature range: Rated for −40 °C to 100 °C to support extended-environment and industrial deployments.
• Compact, high-pin-count package: 1152-BBGA (35×35) FCBGA package enables a dense board footprint while supporting many I/Os.
• Low-voltage core operation: Core supply specified from 820 mV to 880 mV for integration into low-voltage power domains.

Why Choose 5SGXMA4H2F35I2LN?

The 5SGXMA4H2F35I2LN positions itself as a high-density Stratix V GX FPGA option for designs that require a large complement of logic, substantial embedded memory, and a high number of I/Os within a compact FCBGA package. Its industrial temperature rating and documented electrical and switching characteristics in the Stratix V datasheet make it suitable for demanding embedded and system-level applications.

This device is appropriate for engineering teams building complex digital systems that need scalability in logic and memory resources while maintaining a compact board footprint and robust operating temperature range. The provided datasheet material details core, transceiver, and I/O timing characteristics to support system integration and validation.

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