5SGXMA4H2F35I3LG

The 5SGXMA4H2F35I3LG is a Stratix V GX field-programmable gate array (FPGA) offered in an industrial-grade configuration. It delivers high logic capacity, substantial on-chip memory, and a large I/O complement in a 1152‑FBGA (35x35) surface-mount package.

Engineered for designs that require dense programmable logic, significant embedded RAM, and broad I/O capability, this device is positioned for complex digital systems that must operate across a wide temperature range and low core voltage supply.

Key Features

• Core Logic — 420,000 logic elements provide a large programmable fabric for implementing complex digital functions and custom accelerators.
• Embedded Memory — Approximately 37.9 Mbits of on-chip RAM for large buffers, FIFOs, and data-processing structures without external memory.
• I/O Density — Up to 600 general-purpose I/Os to support wide parallel interfaces, multiple peripherals, and high-pin-count designs.
• Package and Mounting — 1152‑FBGA (35x35) supplier package (listed as 1152‑BBGA, FCBGA) in a surface-mount form factor for PCB assembly compatibility.
• Power Supply — Core voltage supply range of 820 mV to 880 mV to match system power-rail requirements.
• Temperature and Grade — Industrial grade operation with an operating temperature range of –40°C to 100°C for deployment in thermally demanding environments.
• Standards and Compliance — RoHS compliant.

Typical Applications

• High-density digital systems — Implement large-scale logic, custom datapaths, and parallel processing engines using 420,000 logic elements and abundant embedded RAM.
• I/O-intensive interfaces — Support complex board-level interfacing and multiple high-pin peripherals with up to 600 I/Os.
• Industrial electronics — Operate across an industrial temperature range (–40°C to 100°C) for control, automation, and instrumentation applications.

Unique Advantages

• Large programmable capacity: 420,000 logic elements enable implementation of extensive custom logic and parallel processing blocks on a single device, reducing board-level complexity.
• Significant on-chip memory: Approximately 37.9 Mbits of embedded RAM minimizes dependency on external memory for buffering and streaming applications.
• High I/O count: 600 I/Os provide flexibility for wide buses, multiple interfaces, and dense connector ecosystems without additional multiplexing.
• Industrial temperature rating: –40°C to 100°C operating range supports deployment in challenging thermal environments common to industrial systems.
• Compact surface-mount package: 1152‑FBGA (35x35) packaging balances high pin count with a board-friendly surface-mount footprint.
• RoHS compliance: Meets environmental regulations for lead-free assembly and product stewardship.

Why Choose 5SGXMA4H2F35I3LG?

The 5SGXMA4H2F35I3LG combines a high logic element count, substantial embedded RAM, and a large I/O complement in an industrial-grade Stratix V GX FPGA. Its power and thermal specifications make it suitable for demanding digital designs where on-chip resources and operating robustness matter. This device is well suited to engineering teams needing scalable programmable capacity, extensive memory for data handling, and broad interface options in a single-package solution.

Request a quote or submit an inquiry to evaluate 5SGXMA4H2F35I3LG for your next design and to discuss availability and lead times.