5SGXMA4H2F35I3WN

The 5SGXMA4H2F35I3WN is a Stratix® V GX field‑programmable gate array (FPGA) IC delivering very high logic density and extensive I/O capability. This industrial‑grade device integrates approximately 420,000 logic elements and approximately 38 Mbits of embedded memory, making it suited for systems that require large programmable logic resources and significant on‑chip RAM.

Designed for surface‑mount applications, the device is packaged in a 1152‑BBGA (FCBGA) 35×35 package, supports up to 600 I/Os, and operates over an industrial temperature range with a core supply window optimized between 0.820 V and 0.880 V.

Key Features

• High Logic Density  Approximately 420,000 logic elements to implement large, complex logic and algorithmic functions.
• Embedded Memory  Approximately 38 Mbits of on‑chip RAM for buffering, LUTRAM, and local data storage to support memory‑intensive designs.
• Extensive I/O  Up to 600 general‑purpose I/Os to enable broad system interfacing and high pin‑count connectivity.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Power and Core Voltage  Core supply voltage specified between 0.820 V and 0.880 V to match system power budgets and core performance points.
• Package and Mounting  1152‑BBGA (FCBGA) surface‑mount package in a 35×35 form factor for high‑density board integration.

Typical Applications

• High‑density programmable systems  Implement large FPGA algorithms, datapath logic, and custom hardware accelerators using extensive logic and embedded RAM.
• I/O‑intensive designs  Support systems requiring many external interfaces or parallel signaling with up to 600 I/Os.
• Industrial control and instrumentation  Deploy in environments that require an extended temperature range and robust component performance.

Unique Advantages

• Highly integrated logic and memory  Large logic element count paired with substantial embedded RAM reduces external memory dependency and simplifies board design.
• Broad I/O capacity  Up to 600 I/Os enable flexible connectivity options and multi‑channel interfacing without immediate external multiplexing.
• Industrial robustness  Specified for −40 °C to 100 °C operation to meet demanding environmental requirements.
• Compact, manufacturable package  1152‑BBGA (35×35) surface‑mount package supports high‑density layouts and automated assembly processes.
• Defined core voltage window  0.820 V–0.880 V supply specification helps align power delivery design and optimize core performance.

Why Choose 5SGXMA4H2F35I3WN?

The 5SGXMA4H2F35I3WN combines large FPGA fabric, substantial embedded memory, and a high I/O count in an industrial‑grade, surface‑mount FCBGA package. It is positioned for designs that demand significant on‑chip logic resources and extensive interfacing while operating across an industrial temperature range.

Its specifications make it suitable for engineering teams building high‑complexity programmable systems where integration, predictable power requirements, and board‑level density are priorities. The Stratix V GX family datasheet provides series‑level electrical and switching characteristics to support detailed design and validation.

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