5SGXMA4H3F35C2LN

The 5SGXMA4H3F35C2LN is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) supplied in a 1152‑BBGA FCBGA package. The device provides high on‑chip logic and memory resources with a large I/O count and a low core voltage operating range, designed for commercial‑grade applications.

Key Features

• Core Logic — 420,000 logic elements provide extensive programmable logic capacity for complex designs.
• Embedded Memory — Approximately 38 Mbits of embedded memory (37,888,000 total RAM bits) for on‑chip data buffering and storage.
• I/O Resources — 600 user I/O pins to support dense interfacing and wide bus implementations.
• Power Supply — Core voltage supply range of 820 mV to 880 mV for the device core.
• Package & Mounting — 1152‑BBGA, FCBGA package; supplier device package listed as 1152‑FBGA (35×35); surface mount mounting type.
• Commercial Grade Temperature — Rated for operation from 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant.

Unique Advantages

• High logic density: 420,000 logic elements enable consolidation of complex functions into a single device, reducing system component count.
• Significant on‑chip memory: Approximately 38 Mbits of embedded RAM supports large buffers and on‑device data storage to improve system responsiveness.
• Extensive I/O capability: 600 I/O pins allow flexible partitioning of signals and direct connection to a wide range of peripherals and buses.
• Compact, industry‑standard package: 1152‑BBGA FCBGA (35×35) surface‑mount package supports high‑density board layouts.
• Commercial temperature suitability: Specified 0 °C to 85 °C operating range for commercial applications.
• Regulatory readiness: RoHS compliance simplifies environmental qualification for many markets.

Why Choose 5SGXMA4H3F35C2LN?

The 5SGXMA4H3F35C2LN combines a large logic fabric, substantial embedded memory, and a high I/O count in a single commercial‑grade Stratix V GX device. It fits designs that require significant on‑chip resources and dense external interfacing while maintaining the board‑level integration benefits of a 1152‑BBGA package and surface‑mount assembly.

This part is suited for teams and systems that need a scalable, high‑capacity FPGA solution with clear electrical and environmental specifications, backed by Intel's Stratix V device documentation.

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