5SGXMA4H3F35C3N

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA

Quantity 1,368 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4H3F35C3N – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXMA4H3F35C3N is a Stratix V GX series field programmable gate array (FPGA) IC designed for high-density, programmable logic applications. It delivers a large logic capacity, substantial on-chip memory, and a high I/O count suitable for complex digital systems.

Key attributes include 420,000 logic elements, approximately 38 Mbits of embedded memory, and up to 600 general-purpose I/O, making the device appropriate for designs that require significant logic integration and I/O bandwidth within a commercial temperature grade.

Key Features

  • Core Logic  420,000 logic elements (logic cells) to implement large-scale programmable logic functions.
  • Embedded Memory  Total on-chip RAM of 37,888,000 bits (approximately 38 Mbits) to support buffering, FIFOs, and local storage.
  • I/O Capacity  Up to 600 I/O pins to interface with high-density systems and multiple external devices.
  • Transceiver and Series-Level Capabilities  Stratix V GX family transceiver and I/O timing capabilities are included in the device series datasheet for high-performance I/O and serial channel support.
  • Power Supply  Core voltage supply specified from 820 mV to 880 mV for device operation.
  • Package and Mounting  1152-ball BGA package (1152-BBGA, FCBGA / supplier package listed as 1152-FBGA (35×35)) with surface-mount mounting for compact board integration.
  • Commercial Grade and Temperature Range  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • RoHS Compliance  RoHS-compliant status for regulatory and environmental conformance.

Typical Applications

  • High-density programmable logic  Implement complex digital functions and custom accelerators using the device's 420,000 logic elements and substantial embedded RAM.
  • High I/O interfacing  Systems requiring large parallel or multi-protocol I/O integration can leverage up to 600 I/O pins for board-level connectivity.
  • Communications and serial channel designs  Designs that benefit from the Stratix V GX series transceiver capabilities and detailed I/O timing control described in the series datasheet.

Unique Advantages

  • Large programmable fabric: 420,000 logic elements enable consolidation of multiple functions into a single device, reducing system complexity.
  • Substantial on-chip memory: Approximately 38 Mbits of embedded RAM supports local buffering and memory-intensive algorithms without immediate external RAM dependence.
  • High I/O count: 600 I/O pins provide flexibility for dense interfacing and multiple peripheral connections.
  • Compact BGA package: 1152-ball FCBGA packaging allows high-pin-count integration in space-constrained board designs.
  • Commercial temperature rating: 0 °C to 85 °C operation is suitable for a wide range of commercial applications.
  • Regulatory compliance: RoHS compliance supports environmentally conscious product designs and supply-chain requirements.

Why Choose 5SGXMA4H3F35C3N?

The 5SGXMA4H3F35C3N positions itself as a high-capacity Stratix V GX FPGA for commercial applications that demand extensive programmable logic, significant embedded memory, and a large number of I/O. Its combination of 420,000 logic elements, approximately 38 Mbits of RAM, and 600 I/O pins enables consolidation of complex functions and high-density interfacing on a single device.

This device is appropriate for engineering teams building high-density digital systems who require predictable commercial-temperature operation, compact BGA packaging, and compliance with RoHS requirements. The Stratix V series datasheet provides additional series-level electrical and transceiver details to support integration and timing planning.

Request a quote or submit a product inquiry to get pricing and availability information for the 5SGXMA4H3F35C3N.

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