5SGXMA4H3F35C4G

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA

Quantity 441 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4H3F35C4G – Stratix V GX FPGA, 420,000 logic elements, 1152‑FBGA (35×35)

The 5SGXMA4H3F35C4G is a Stratix® V GX field programmable gate array (FPGA) designed for high-capacity, high‑throughput system designs. It combines large logic resources, substantial on‑chip RAM, and a high I/O count to address complex digital processing, high‑speed connectivity and dense system integration requirements.

Targeted for commercial applications, this device delivers a balance of integration and performance with industry‑grade packaging and RoHS compliance for straightforward board‑level deployment.

Key Features

  • Core Logic : 420,000 logic elements providing large-scale programmable logic capacity for complex algorithms and custom acceleration.
  • Embedded Memory : Approximately 37.9 Mbits of on‑chip RAM to support buffering, caches and data‑intensive processing close to the fabric.
  • I/O Density : 600 user I/Os to enable broad peripheral and board-level connectivity options.
  • High‑Speed Transceiver Capability : Stratix V GX series transceiver grading is supported at series level (series documentation details up to 14.1 Gbps GX channel capability), enabling high‑throughput serial links where required.
  • Power and Voltage : Core supply specified from 820 mV to 880 mV for device power provisioning and system power‑rail planning.
  • Package & Mounting : 1152‑FBGA (35×35) package, listed as 1152‑BBGA, FCBGA in supplier data; surface‑mount device for standard PCB assembly flows.
  • Commercial Temperature Grade : Rated for 0 °C to 85 °C operation for commercial applications.
  • Regulatory : RoHS compliant.

Typical Applications

  • High‑Performance Data Processing : Use the large logic capacity and embedded RAM for acceleration of signal processing, packet processing, and algorithmic workloads.
  • High‑Speed Serial Communications : Leverage Stratix V GX transceiver grading at the series level to implement multi‑Gbps serial links and backplane or board‑to‑board interfaces.
  • System Integration & Prototyping : 600 I/Os and a high pin‑count FBGA package enable dense interfacing to peripherals, memory, and custom daughter cards.

Unique Advantages

  • Large Programmable Fabric : 420,000 logic elements allow substantial on‑chip implementation of custom logic and IP without offloading to external devices.
  • Significant On‑Chip Memory : Approximately 37.9 Mbits of embedded RAM reduces dependence on external memory for many buffering and local storage needs.
  • High I/O Count : 600 user I/Os provide flexibility for wide buses, multiple interfaces, and parallel connectivity on compact PCBs.
  • Compact, Industry‑Standard Package : 1152‑FBGA (35×35) package supports surface‑mount assembly and high‑density board designs.
  • Commercial‑Grade Operation : Rated 0 °C to 85 °C for mainstream commercial products and prototypes.
  • RoHS Compliance : Aligns with common electronic manufacturing and environmental requirements.

Why Choose 5SGXMA4H3F35C4G?

This Stratix V GX device positions itself as a high‑capacity FPGA for designers who need substantial programmable logic, plentiful embedded RAM, and broad I/O in a single surface‑mount package. Its specification set—420,000 logic elements, approximately 37.9 Mbits of on‑chip RAM, 600 I/Os, and a 1152‑FBGA (35×35) footprint—supports dense system integration and complex processing tasks within commercial temperature ranges.

Choose this part when your design requires scalable logic resources, significant local memory, and the I/O bandwidth to connect multiple subsystems, while maintaining RoHS compliance and standard board‑assembly compatibility. Series documentation provides detailed electrical and switching characteristics to guide power, timing and transceiver integration.

Request a quote or submit a pricing inquiry through your preferred procurement channel to evaluate 5SGXMA4H3F35C4G for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up