5SGXMA4H3F35C4G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 441 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 158500 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 37888000 |
Overview of 5SGXMA4H3F35C4G – Stratix V GX FPGA, 420,000 logic elements, 1152‑FBGA (35×35)
The 5SGXMA4H3F35C4G is a Stratix® V GX field programmable gate array (FPGA) designed for high-capacity, high‑throughput system designs. It combines large logic resources, substantial on‑chip RAM, and a high I/O count to address complex digital processing, high‑speed connectivity and dense system integration requirements.
Targeted for commercial applications, this device delivers a balance of integration and performance with industry‑grade packaging and RoHS compliance for straightforward board‑level deployment.
Key Features
- Core Logic : 420,000 logic elements providing large-scale programmable logic capacity for complex algorithms and custom acceleration.
- Embedded Memory : Approximately 37.9 Mbits of on‑chip RAM to support buffering, caches and data‑intensive processing close to the fabric.
- I/O Density : 600 user I/Os to enable broad peripheral and board-level connectivity options.
- High‑Speed Transceiver Capability : Stratix V GX series transceiver grading is supported at series level (series documentation details up to 14.1 Gbps GX channel capability), enabling high‑throughput serial links where required.
- Power and Voltage : Core supply specified from 820 mV to 880 mV for device power provisioning and system power‑rail planning.
- Package & Mounting : 1152‑FBGA (35×35) package, listed as 1152‑BBGA, FCBGA in supplier data; surface‑mount device for standard PCB assembly flows.
- Commercial Temperature Grade : Rated for 0 °C to 85 °C operation for commercial applications.
- Regulatory : RoHS compliant.
Typical Applications
- High‑Performance Data Processing : Use the large logic capacity and embedded RAM for acceleration of signal processing, packet processing, and algorithmic workloads.
- High‑Speed Serial Communications : Leverage Stratix V GX transceiver grading at the series level to implement multi‑Gbps serial links and backplane or board‑to‑board interfaces.
- System Integration & Prototyping : 600 I/Os and a high pin‑count FBGA package enable dense interfacing to peripherals, memory, and custom daughter cards.
Unique Advantages
- Large Programmable Fabric : 420,000 logic elements allow substantial on‑chip implementation of custom logic and IP without offloading to external devices.
- Significant On‑Chip Memory : Approximately 37.9 Mbits of embedded RAM reduces dependence on external memory for many buffering and local storage needs.
- High I/O Count : 600 user I/Os provide flexibility for wide buses, multiple interfaces, and parallel connectivity on compact PCBs.
- Compact, Industry‑Standard Package : 1152‑FBGA (35×35) package supports surface‑mount assembly and high‑density board designs.
- Commercial‑Grade Operation : Rated 0 °C to 85 °C for mainstream commercial products and prototypes.
- RoHS Compliance : Aligns with common electronic manufacturing and environmental requirements.
Why Choose 5SGXMA4H3F35C4G?
This Stratix V GX device positions itself as a high‑capacity FPGA for designers who need substantial programmable logic, plentiful embedded RAM, and broad I/O in a single surface‑mount package. Its specification set—420,000 logic elements, approximately 37.9 Mbits of on‑chip RAM, 600 I/Os, and a 1152‑FBGA (35×35) footprint—supports dense system integration and complex processing tasks within commercial temperature ranges.
Choose this part when your design requires scalable logic resources, significant local memory, and the I/O bandwidth to connect multiple subsystems, while maintaining RoHS compliance and standard board‑assembly compatibility. Series documentation provides detailed electrical and switching characteristics to guide power, timing and transceiver integration.
Request a quote or submit a pricing inquiry through your preferred procurement channel to evaluate 5SGXMA4H3F35C4G for your next design.

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