5SGXMA4H3F35C4WN

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA

Quantity 1,139 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4H3F35C4WN – Stratix® V GX FPGA, 420,000 logic elements, 1152‑BBGA

The 5SGXMA4H3F35C4WN is a Stratix® V GX field programmable gate array (FPGA) IC offering high logic density and extensive I/O in a compact FCBGA package. It provides a large programmable fabric and embedded memory capacity targeted at designs that require substantial on‑chip logic, flexible I/O timing, and transceiver‑capable Stratix V GX family functionality.

Manufactured for commercial applications, this device combines 420,000 logic elements with approximately 37.9 Mbits of embedded memory and up to 600 user I/Os in a 1152‑BBGA (35 × 35 mm) surface‑mount package.

Key Features

  • Core Logic — 420,000 logic elements providing large-scale programmable logic capacity for complex custom digital designs.
  • On‑Chip Memory — Approximately 37.9 Mbits of embedded RAM for buffering, lookup tables, and data storage within the fabric.
  • I/O Capacity — Up to 600 user I/Os to support wide parallel interfaces and extensive board-level connectivity.
  • Power Supply — Core supply operating between 820 mV and 880 mV, enabling defined power budgeting and thermal planning in system designs.
  • Package & Mounting — 1152‑BBGA, FCBGA (supplier device package: 1152‑FBGA, 35 × 35 mm) in a surface‑mount form factor for high‑density board integration.
  • Temperature & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
  • Environmental Compliance — RoHS compliant to support regulatory and assembly requirements.
  • Series Characteristics — Part of the Stratix V GX family; electrical and switching characteristics (including transceiver and I/O timing detail) are documented in the device datasheet for design reference.

Typical Applications

  • High‑speed serial and communication systems — Leverage the Stratix V GX family’s transceiver capabilities and programmable I/O timing for serial link and connectivity designs.
  • Data‑path and protocol processing — Use the large logic capacity and on‑chip memory for packet processing, protocol engines, and data buffering tasks.
  • Custom digital acceleration — Implement compute‑intensive or application‑specific accelerators where high logic density and local RAM reduce external memory dependency.
  • Prototyping and system integration — Integrate complex subsystems and perform hardware validation in a compact FCBGA package suitable for commercial product development.

Unique Advantages

  • High logic density: 420,000 logic elements enable complex, highly parallel architectures without excessive external components.
  • Substantial embedded memory: Approximately 37.9 Mbits of on‑chip RAM supports deep buffering and state storage inside the FPGA fabric.
  • Extensive I/O count: Up to 600 I/Os provide flexibility for wide buses, numerous peripherals, and multi‑lane interfaces.
  • Compact, board‑ready package: 1152‑BBGA (35 × 35 mm) surface‑mount package balances pin‑count and PCB area for dense system designs.
  • Defined power envelope: Core supply range of 0.82–0.88 V helps with power sequencing and thermal design considerations.
  • Commercial availability and compliance: Commercial temperature grade and RoHS compliance facilitate standard production and assembly processes.

Why Choose 5SGXMA4H3F35C4WN?

The 5SGXMA4H3F35C4WN delivers a combination of large programmable logic capacity, significant embedded memory, and high I/O density in a compact FCBGA package—making it suitable for commercial designs that require on‑device resources and flexible I/O. As a Stratix V GX family device, its documented electrical and switching characteristics support designs that need careful I/O timing and transceiver behavior assessment.

This device is ideal for engineering teams designing communication systems, data‑path accelerators, and complex prototypes where on‑chip logic and memory integration reduce BOM complexity and simplify system partitioning. RoHS compliance and a defined commercial temperature range support mainstream production and assembly workflows.

Request a quote or submit your RFQ today to receive pricing and availability details for the 5SGXMA4H3F35C4WN.

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