5SGXMA4H3F35I3LN

The 5SGXMA4H3F35I3LN is a Stratix V GX Field Programmable Gate Array (FPGA) offered in an industrial temperature grade. It delivers high logic density and substantial on-chip memory capacity in a 1152‑BBGA FCBGA package for surface‑mount applications.

Designed for systems that require a combination of large programmable logic, abundant I/O, and robust operating range, this device provides a platform for integration where board‑level consolidation and reliable performance across −40 °C to 100 °C are required.

Key Features

• Core Capacity  420,000 logic elements (cells), enabling significant on‑chip integration of digital logic and custom processing blocks.
• Embedded Memory  Approximately 37.9 Mbits of on‑chip RAM, providing local storage for buffering, state machines, and data processing.
• I/O Density  Up to 600 user I/O pins, supporting complex interfacing and multiple parallel data paths.
• Stratix V GX Family  Part of the Stratix V GX series; the series datasheet documents transceiver and switching characteristics relevant to high‑performance designs.
• Power and Core Voltage  Core supply range of 820 mV to 880 mV to match system power design requirements.
• Package and Mounting  1152‑BBGA, FCBGA package; supplier device package specified as 1152‑FBGA (35×35). Surface mount suitable for standard PCB assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, appropriate for industrial environments.
• Environmental Compliance  RoHS compliant, meeting common environmental-material requirements.

Typical Applications

• Industrial Control and Automation  Industrial temperature rating and wide operating range make it suitable for control systems that require substantial logic and numerous I/O connections.
• Data Processing and Acceleration  High logic element count and nearly 38 Mbits of embedded memory support custom data‑path and buffering implementations.
• Networking and Communications Infrastructure  As a Stratix V GX family device, it aligns with designs that reference the family’s transceiver and switching capabilities documented in the series datasheet.

Unique Advantages

• High Logic Density: 420,000 logic elements reduce the need for multiple FPGAs or external glue logic by enabling larger functions on a single device.
• Substantial On‑Chip Memory: Approximately 37.9 Mbits of embedded RAM supports local buffering and reduces external memory bandwidth requirements.
• Large I/O Count: 600 I/O pins enable extensive peripheral and bus connectivity without additional I/O expanders.
• Industrial Reliability: Rated −40 °C to 100 °C and supplied in a robust BGA package for demanding operating environments.
• RoHS Compliant: Meets environmental-material requirements common to modern electronic products.

Why Choose 5SGXMA4H3F35I3LN?

5SGXMA4H3F35I3LN combines a high logic element count, a large block of embedded RAM, and an extensive I/O complement in a single industrial‑grade Stratix V GX FPGA. The device is positioned for designs that require significant on‑chip integration, a broad operating temperature window, and the package density of a 1152‑FBGA (35×35) surface‑mount solution.

For engineering teams and procurement evaluating scalable FPGA platforms, this part provides clear, verifiable capacity and environmental characteristics suitable for mid‑ to high‑complexity industrial and communications applications, backed by the Stratix V family documentation.

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