5SGXMA4H3F35I3WN

The 5SGXMA4H3F35I3WN is an industrial-grade Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, optimized for high-density, high-performance designs. It provides a large programmable fabric and high I/O count to support complex digital systems where logic density, embedded memory, and flexible connectivity are required.

Built on the Stratix V GX family architecture, this device targets demanding FPGA applications that require substantial on-chip memory and extensive I/O while operating across an industrial temperature range.

Key Features

• Programmable Logic Density 
  Approximately 420,000 logic elements enabling large, complex designs and significant logic integration.
• Logic Array Blocks (LABs) 
  158,500 LABs for structured logic grouping and efficient resource utilization.
• Embedded Memory 
  Approximately 37.9 Mbits of on-chip RAM to support buffering, block memory, and data-path requirements.
• I/O Capability 
  600 I/Os to accommodate wide external interfaces and multiple parallel connections.
• Package & Mounting 
  1152-BBGA (FCBGA) — supplier package listed as 1152-FBGA (35×35); surface-mount package suitable for compact board layouts.
• Power Supply 
  Core voltage range of 0.820 V to 0.880 V for defined operating conditions.
• Industrial Temperature Grade 
  Rated for operation from −40 °C to 100 °C to meet industrial thermal requirements.
• Compliance 
  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• High-density digital systems — Use the large logic element count and LAB capacity for complex FPGA implementations and custom silicon emulation.
• Data buffering and packet processing — Leverage approximately 37.9 Mbits of embedded RAM for FIFOs, packet queues, and memory-intensive data-path tasks.
• Multi-interface controllers — Take advantage of 600 I/Os to interface with multiple high-pin-count peripherals and parallel buses.
• Industrial equipment and instrumentation — Industrial temperature rating and robust package make it suitable for factory automation and test systems that require reliable performance across wide temperature ranges.

Unique Advantages

• High logic capacity: The 420,000 logic elements support large-scale integration, reducing the need for multi-chip solutions.
• Substantial on-chip memory: Approximately 37.9 Mbits of RAM enable efficient local data storage and reduce external memory dependence.
• Extensive I/O count: 600 I/Os provide flexible connectivity for complex system topologies and multiple peripheral interfaces.
• Industrial thermal range: −40 °C to 100 °C operation helps ensure stability in demanding environments.
• Compact, robust packaging: 1152-BBGA (35×35) surface-mount package facilitates high-density PCB designs while supporting reliable solder mounting.
• Controlled core voltage: Narrow 0.820 V–0.880 V supply range simplifies power delivery design for the FPGA core.

Why Choose 5SGXMA4H3F35I3WN?

The 5SGXMA4H3F35I3WN provides a combination of high logic density, ample embedded memory, and a large I/O footprint in an industrial-grade Stratix V GX device. It is positioned for designs that demand significant on-chip resources and reliable operation across extended temperature ranges.

This part is well suited to engineering teams building sophisticated, high-pin-count systems that require consolidation of functionality into a single FPGA, offering scalability and predictable electrical and thermal characteristics consistent with the Stratix V family.

Request a quote or submit an inquiry to obtain pricing, availability, and additional technical information for the 5SGXMA4H3F35I3WN FPGA.