5SGXMA4H3F35I3N

The 5SGXMA4H3F35I3N is a Stratix® V GX Field Programmable Gate Array (FPGA) optimized for high-density, industrial-grade programmable logic. It combines 420,000 logic elements with approximately 37.9 Mbits of embedded RAM and 600 I/Os in a 1152-BBGA (35×35) FCBGA package to address complex digital designs that require substantial logic, memory, and connectivity.

Designed as an industrial-grade device (operating −40 °C to 100 °C) with a core voltage supply range of 820 mV to 880 mV, this device is appropriate for systems that demand robust thermal range and high integration in a surface-mount package.

Key Features

• Logic Capacity  420,000 logic elements providing large-scale programmable logic resources for complex designs.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support buffering, state storage, and embedded data structures.
• I/O Density  600 I/O pins to support high-pin-count interfaces and extensive board-level connectivity.
• Package & Mounting  1152-BBGA (FCBGA) supplier package (1152-FBGA, 35×35) in a surface-mount form factor for compact, high-density PCB implementations.
• Power  Core supply voltage specified between 820 mV and 880 mV for the device core domain.
• Industrial Temperature Grade  Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
• Standards Compliance  RoHS compliant.
• Stratix V GX Family Characteristics  Part of the Stratix V GX series, which the datasheet describes in the context of commercial and industrial speed grades and transceiver capabilities (refer to device documentation for series-level transceiver details).

Typical Applications

• Industrial embedded systems  Use the device where industrial temperature range and high logic/memory density are required for control, data acquisition, and processing tasks.
• High-pin-count board designs  Large I/O count and a compact FCBGA package make it suitable for designs needing many external interfaces in a small footprint.
• Complex digital processing  High logic element count and on-chip RAM enable implementation of large-scale digital signal processing, packet buffering, and protocol handling.

Unique Advantages

• High logic density:  420,000 logic elements enable integration of complex functions into a single device, reducing system partitioning.
• Significant on-chip memory:  Approximately 37.9 Mbits of embedded RAM help minimize external memory dependencies for many designs.
• Extensive I/O resources:  600 I/Os provide flexibility for interfacing to multiple peripherals, sensors, and high-pin-count subsystems.
• Industrial reliability:  Rated for −40 °C to 100 °C operation to support deployment in temperature-challenging environments.
• Compact surface-mount package:  1152-BBGA (35×35 FCBGA) delivers high integration in a board-friendly form factor.
• Regulatory compliance:  RoHS compliant for environmental and manufacturing considerations.

Why Choose 5SGXMA4H3F35I3N?

The 5SGXMA4H3F35I3N positions itself as a high-capacity Stratix V GX FPGA offering a balance of large programmable logic, substantial embedded RAM, and a very high I/O count in an industrial-temperature, surface-mount BBGA package. Its specifications make it well suited for designs that require consolidated functionality, significant on-chip memory, and extensive external interfacing within a compact footprint.

Engineers and procurement teams seeking a scalable, industrial-grade programmable device will find this part appropriate for complex digital processing and integration tasks. For detailed electrical and switching characteristics, refer to the device documentation for Stratix V series-level information and device-specific operational parameters.

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