5SGXMA4H3F35I4N

The 5SGXMA4H3F35I4N is a Stratix® V GX field programmable gate array (FPGA) optimized for designs requiring very high logic capacity, substantial embedded memory, and extensive I/O. Built in an FCBGA 1152-ball package, this industrial-grade device supports a low-voltage core and a broad operating temperature range for deployment in demanding environments.

This device targets applications that need dense programmable logic, significant on-chip RAM, and flexible external interfacing while maintaining industrial temperature operation and surface-mount packaging.

Key Features

• Core Logic  Provides 420,000 logic elements for implementing large-scale digital designs and complex algorithms.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support buffering, FIFOs, and local storage for compute pipelines.
• I/O Capacity  600 user I/O pins to enable dense connectivity to peripherals, memory, and multi-lane external interfaces.
• Power and Voltage  Core voltage supply range of 820 mV to 880 mV for the device core.
• Package & Mounting  1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount device for PCB assembly.
• Operating Conditions  Industrial-grade device rated for an operating temperature range of –40 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density networking and packet processing  Large logic capacity and plentiful on-chip RAM enable protocol processing, packet buffering, and custom network functions.
• Hardware acceleration and data-path processing  Substantial logic and memory resources support acceleration of compute kernels and custom datapaths in data-center and edge systems.
• Industrial control and automation  Industrial temperature range and extensive I/O make the device suitable for sensor aggregation, motor control logic, and complex control algorithms.
• Prototype and system integration  High I/O count and dense logic resources facilitate rapid prototyping and integration of multi-function systems on a single device.

Unique Advantages

• High logic capacity: 420,000 logic elements let you consolidate multiple functions into one FPGA, reducing system complexity and BOM count.
• Significant on-chip memory: Approximately 37.9 Mbits of embedded RAM supports large buffers and intermediate storage without external memory.
• Large I/O footprint: 600 I/O pins provide flexibility for wide parallel interfaces, high-pin-count buses, and mixed-signal subsystem connections.
• Industrial temperature rating: Operation from –40 °C to 100 °C addresses a wide range of deployment environments requiring robust thermal tolerance.
• Compact FCBGA packaging: 1152-ball FCBGA (35×35) balances high pin count with a compact footprint for space-constrained PCB designs.
• Low-voltage core operation: 0.82 V–0.88 V core supply enables compatibility with tightly controlled power domains in modern system architectures.

Why Choose 5SGXMA4H3F35I4N?

The 5SGXMA4H3F35I4N is positioned for designs that demand very high programmable logic density, sizable embedded memory, and extensive external interfacing while operating across industrial temperatures. Its combination of 420,000 logic elements, approximately 37.9 Mbits of on-chip RAM, and 600 I/O makes it suitable for consolidating complex functions and reducing overall system component count.

Engineers building networking equipment, hardware accelerators, industrial controllers, or high-density prototypes will find the device’s resource profile and packaging well-suited to scalable, robust designs that require long-term availability and predictable electrical characteristics.

Request a quote or submit an inquiry for pricing and availability to evaluate the 5SGXMA4H3F35I4N for your next design.