5SGXMA4K1F35C1N

The 5SGXMA4K1F35C1N is a Stratix® V GX field programmable gate array (FPGA) IC designed for applications that require high logic density, substantial on-chip memory, and extensive I/O connectivity. It is supplied in a 1152‑FBGA (35×35) package and is offered as a commercial‑grade device.

With 420,000 logic elements, approximately 37.888 Mbits of embedded RAM, and 600 user I/O pins, this device targets designs that need large programmable fabric and dense system integration while operating within standard commercial temperature and voltage ranges.

Key Features

• Core Logic — 420,000 logic elements and 158,500 logic array blocks (LABs) provide substantial programmable fabric for complex logic, DSP, and control functions.
• Embedded Memory — Approximately 37.888 Mbits of on‑chip RAM for buffering, packet processing, and data‑centric logic without immediate reliance on external memory.
• I/O Density — 600 user I/O pins to support multi‑lane interfaces, wide parallel buses, and dense system interconnect.
• Package — 1152‑FBGA (35×35) FCBGA package for high pin count in a compact surface‑mount form factor.
• Power and Core Voltage — Core supply range specified from 870 mV to 930 mV for the device core operating supply.
• Operating Range — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Mounting and Compliance — Surface mount package with RoHS compliance.

Typical Applications

• High‑density signal processing — Large logic element count and on‑chip RAM support complex DSP pipelines and real‑time data manipulation.
• Multi‑lane interface aggregation — 600 I/O pins enable aggregation and bridging of multiple high‑pin‑count serial or parallel interfaces.
• Custom accelerators — Substantial programmable fabric allows implementation of bespoke compute and acceleration blocks for specialized workloads.

Unique Advantages

• Highly integrated programmable fabric: 420,000 logic elements and 158,500 LABs reduce dependence on external programmable logic and discrete glue logic.
• Large embedded memory: Approximately 37.888 Mbits of on‑chip RAM simplifies data buffering and lowers external memory bandwidth needs.
• Extensive I/O capacity: 600 user I/O pins provide flexibility for dense system interconnect and parallel data paths.
• Compact high‑pin package: 1152‑FBGA (35×35) delivers high pin count while maintaining a surface‑mount footprint for modern PCB layouts.
• Commercial temperature and voltage support: Operates from 0 °C to 85 °C with a defined core supply range (870 mV–930 mV) for predictable system power planning.
• RoHS compliant: Environmentally compliant manufacturing and assembly.

Why Choose 5SGXMA4K1F35C1N?

The 5SGXMA4K1F35C1N combines a large, flexible logic fabric with substantial embedded memory and a high I/O count in a space‑efficient 1152‑FBGA package, making it suitable for designs that require dense programmable logic and broad interfacing without immediate reliance on external components. Its commercial temperature grade and defined core voltage range simplify integration into systems targeting standard operating environments.

This device is positioned for engineering teams building scalable, memory‑intensive, and I/O‑heavy programmable logic solutions that benefit from the Stratix V GX family documentation and device specifications.

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