5SGXMA4K1F35C2LG

The 5SGXMA4K1F35C2LG is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offering high logic density and abundant on-chip memory in a compact FCBGA package. This device is designed for designs that require large programmable logic capacity, substantial embedded RAM, and extensive I/O connectivity.

With 420,000 logic elements and approximately 37.9 Mbits of embedded memory, the part delivers integration for complex logic functions while providing 600 I/O pins for high channel counts. The device is supplied for commercial-grade applications with a specified operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic Capacity  420,000 logic elements provide substantial programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support buffering, on-chip data storage, and state retention.
• I/O Count  600 I/O pins to support high channel-count interfacing and broad peripheral connectivity.
• Power Supply  Core supply voltage specified from 820 mV to 880 mV, enabling precise power-domain planning.
• Package & Mounting  1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant, supporting regulatory and manufacturing requirements for lead-free assembly.

Typical Applications

• High-density digital processing  Use the large logic element count and on-chip RAM for complex data-paths, state machines, and algorithm implementation.
• High-channel-count I/O systems  600 I/Os allow integration of many parallel interfaces, sensors, or peripheral channels in a single device.
• Custom accelerators and datapath engines  Combine abundant logic and embedded memory to implement application-specific accelerators or packet-processing pipelines.

Unique Advantages

• Large programmable fabric: 420,000 logic elements reduce the need for multi-device solutions when implementing complex logic.
• Substantial on-chip memory: Approximately 37.9 Mbits of RAM supports buffering and local data storage, simplifying board-level memory requirements.
• High I/O density: 600 I/Os provide flexibility for dense external connectivity and parallel interfacing.
• Compact FCBGA packaging: 1152-BBGA (1152-FBGA, 35×35) delivers high pin count in a space-efficient surface-mount package.
• Commercial temperature availability: Rated 0 °C to 85 °C for deployment in commercial environments.
• Regulatory readiness: RoHS compliant to meet lead-free assembly requirements.

Why Choose 5SGXMA4K1F35C2LG?

The 5SGXMA4K1F35C2LG positions itself as a high-capacity Stratix V GX FPGA option for designs that need extensive logic resources, significant embedded memory, and broad I/O capability in a single surface-mount FCBGA package. Its combination of 420,000 logic elements, approximately 37.9 Mbits of on-chip RAM, and 600 I/Os supports consolidation of complex functions and high channel counts without resorting to multiple devices.

Engineers and procurement teams seeking a commercial-grade FPGA with precise core voltage specification (820 mV to 880 mV), a compact 1152-BBGA footprint, and RoHS compliance can rely on this device for scalable, high-density integration while maintaining predictable operating conditions within the specified temperature range.

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