5SGXMA4K1F35I2G

IC FPGA 600 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA

Quantity 707 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O600Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXMA4K1F35I2G – Stratix® V GX FPGA, 420,000 logic elements, 600 I/O

The 5SGXMA4K1F35I2G is a Stratix V GX field programmable gate array (FPGA) in an industrial-grade package. It delivers a high-density logic fabric with substantial embedded memory and a large I/O count for designs that require extensive on-chip resources and connectivity.

Built for surface-mount board assemblies, this device is specified with a low-voltage core supply range and an extended operating temperature range, providing a predictable platform for demanding embedded and system-level designs.

Key Features

  • Logic Capacity  Approximately 420,000 logic elements for implementing complex digital designs and large combinational/sequential logic blocks.
  • Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support buffering, packet processing, and large local data structures without external memory.
  • I/O Resources  600 general-purpose I/O pins to support extensive peripheral interfacing and high pin-count designs.
  • Power and Core Voltage  Core supply specified from 870 mV to 930 mV to match established low-voltage FPGA power domains.
  • Package and Mounting  1152-BBGA (1152-FBGA, 35 × 35) FCBGA package in a surface-mount form factor for compact, high-density PCB layouts.
  • Temperature and Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for applications requiring extended temperature tolerance.
  • Standards and Compliance  RoHS-compliant manufacturing status for environmental compliance in supply chains.

Typical Applications

  • High-density digital processing  Implement complex logic pipelines and large state machines using the device’s ~420k logic elements and embedded RAM.
  • I/O-intensive systems  Systems that require many external connections can leverage the device’s 600 I/O pins for broad peripheral and bus support.
  • Industrial control and instrumentation  Industrial deployments that need extended temperature range and robust packaging can benefit from the device’s industrial rating and FCBGA package.

Unique Advantages

  • High on-chip integration: Consolidate logic and memory-intensive functions on-chip with ~420,000 logic elements and approximately 37.9 Mbits of embedded RAM, reducing external component count.
  • Large I/O capacity: 600 I/O pins enable complex interfacing and parallel data paths without extensive external multiplexing.
  • Industrial temperature tolerance: Rated from −40 °C to 100 °C to support designs operating in challenging thermal environments.
  • Compact, high-density package: 1152-FBGA (35 × 35) surface-mount package enables dense PCB routing for space-constrained systems.
  • Low-voltage core operation: Core supply range of 870 mV to 930 mV aligns with modern low-voltage system architectures to manage power delivery and thermal profiles.
  • Regulatory compliance: RoHS-compliant construction supports environmentally conscious manufacturing and distribution requirements.

Why Choose 5SGXMA4K1F35I2G?

The 5SGXMA4K1F35I2G positions itself as a high-density Stratix V GX FPGA option for engineers who need substantial logic capacity, significant on-chip RAM, and a large I/O complement in an industrial-grade, surface-mount package. Its combination of core voltage specifications and extended temperature range provides a clear, specification-driven foundation for robust system designs.

This device is well suited for teams designing systems that must balance integration, I/O throughput, and thermal/environmental tolerance while maintaining a compact PCB footprint and RoHS compliance.

Request a quote or submit an inquiry to start the procurement process for 5SGXMA4K1F35I2G and discuss availability and lead times.

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