5SGXMA4K1F35I2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 707 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 158500 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 37888000 |
Overview of 5SGXMA4K1F35I2G – Stratix® V GX FPGA, 420,000 logic elements, 600 I/O
The 5SGXMA4K1F35I2G is a Stratix V GX field programmable gate array (FPGA) in an industrial-grade package. It delivers a high-density logic fabric with substantial embedded memory and a large I/O count for designs that require extensive on-chip resources and connectivity.
Built for surface-mount board assemblies, this device is specified with a low-voltage core supply range and an extended operating temperature range, providing a predictable platform for demanding embedded and system-level designs.
Key Features
- Logic Capacity Approximately 420,000 logic elements for implementing complex digital designs and large combinational/sequential logic blocks.
- Embedded Memory Approximately 37.9 Mbits of on-chip RAM to support buffering, packet processing, and large local data structures without external memory.
- I/O Resources 600 general-purpose I/O pins to support extensive peripheral interfacing and high pin-count designs.
- Power and Core Voltage Core supply specified from 870 mV to 930 mV to match established low-voltage FPGA power domains.
- Package and Mounting 1152-BBGA (1152-FBGA, 35 × 35) FCBGA package in a surface-mount form factor for compact, high-density PCB layouts.
- Temperature and Grade Industrial-grade device rated for operation from −40 °C to 100 °C for applications requiring extended temperature tolerance.
- Standards and Compliance RoHS-compliant manufacturing status for environmental compliance in supply chains.
Typical Applications
- High-density digital processing Implement complex logic pipelines and large state machines using the device’s ~420k logic elements and embedded RAM.
- I/O-intensive systems Systems that require many external connections can leverage the device’s 600 I/O pins for broad peripheral and bus support.
- Industrial control and instrumentation Industrial deployments that need extended temperature range and robust packaging can benefit from the device’s industrial rating and FCBGA package.
Unique Advantages
- High on-chip integration: Consolidate logic and memory-intensive functions on-chip with ~420,000 logic elements and approximately 37.9 Mbits of embedded RAM, reducing external component count.
- Large I/O capacity: 600 I/O pins enable complex interfacing and parallel data paths without extensive external multiplexing.
- Industrial temperature tolerance: Rated from −40 °C to 100 °C to support designs operating in challenging thermal environments.
- Compact, high-density package: 1152-FBGA (35 × 35) surface-mount package enables dense PCB routing for space-constrained systems.
- Low-voltage core operation: Core supply range of 870 mV to 930 mV aligns with modern low-voltage system architectures to manage power delivery and thermal profiles.
- Regulatory compliance: RoHS-compliant construction supports environmentally conscious manufacturing and distribution requirements.
Why Choose 5SGXMA4K1F35I2G?
The 5SGXMA4K1F35I2G positions itself as a high-density Stratix V GX FPGA option for engineers who need substantial logic capacity, significant on-chip RAM, and a large I/O complement in an industrial-grade, surface-mount package. Its combination of core voltage specifications and extended temperature range provides a clear, specification-driven foundation for robust system designs.
This device is well suited for teams designing systems that must balance integration, I/O throughput, and thermal/environmental tolerance while maintaining a compact PCB footprint and RoHS compliance.
Request a quote or submit an inquiry to start the procurement process for 5SGXMA4K1F35I2G and discuss availability and lead times.

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