5SGXMA4K1F35I2N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 464 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 158500 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 37888000 |
Overview of 5SGXMA4K1F35I2N – Stratix® V GX Field Programmable Gate Array (FPGA), 1152‑BBGA FCBGA
The 5SGXMA4K1F35I2N is an Intel Stratix V GX family FPGA offered in an industrial-grade configuration. It provides a high-density programmable logic fabric with substantial on-chip memory and a large number of user I/Os for complex, system-level implementations.
Key hardware characteristics include approximately 420,000 logic elements, approximately 37.9 Mbits of embedded RAM, 600 user I/Os, a 1152‑BBGA FCBGA package, and industrial operating range from -40 °C to 100 °C. The device operates with a core voltage supply range of 870 mV to 930 mV and is RoHS compliant.
Key Features
- Core density Approximately 420,000 logic elements provide large programmable logic capacity for complex designs.
- Embedded memory Approximately 37.9 Mbits of on-chip RAM (37,888,000 bits) to support buffering, state storage, and memory-intensive logic.
- I/O resources 600 user I/Os enable wide external connectivity and flexible interfacing with peripherals and subsystems.
- Package and mounting 1152‑BBGA (FCBGA) package; supplier package listed as 1152‑FBGA (35×35). Surface-mount type suitable for compact board layouts.
- Power/core supply Specified core voltage range of 870 mV to 930 mV for core power planning and supply design.
- Industrial-grade operation Grade: Industrial with an operating temperature range of -40 °C to 100 °C for deployment in thermally demanding environments.
- Regulatory status RoHS compliant.
Typical Applications
- High-density packet processing Large logic capacity and significant on-chip RAM support complex packet-processing pipelines and protocol acceleration.
- Compute and algorithm acceleration Substantial logic and memory resources enable implementation of custom accelerators and algorithm offload functions.
- Industrial control and instrumentation Industrial temperature rating and extensive I/O count suit system-level control, signal aggregation, and deterministic processing tasks.
Unique Advantages
- High logic capacity: Approximately 420,000 logic elements reduce the need for multi-device partitioning on large designs.
- Significant on-chip RAM: Approximately 37.9 Mbits of embedded memory provides headroom for deep buffering and stateful processing without immediate external memory dependency.
- Extensive external connectivity: 600 user I/Os allow flexible interfacing to a wide variety of external components and parallel I/O buses.
- Industrial thermal range: Rated from -40 °C to 100 °C to support deployment in harsher operating environments.
- Compact FCBGA package: 1152‑BBGA packaging (35×35 supplier footprint) offers a dense junction of silicon capability in a surface-mount form factor.
- Low-voltage core compatibility: Core supply range of 870 mV to 930 mV aligns with modern low-voltage FPGA power domains and supply designs.
Why Choose 5SGXMA4K1F35I2N?
The 5SGXMA4K1F35I2N combines very large programmable logic capacity, substantial embedded RAM, and a high I/O count in a single industrial-grade FCBGA package. These characteristics make it suitable for engineers designing systems that require on-chip scale for complex logic, buffering, and broad external interfacing while maintaining industrial temperature robustness.
Backed by Intel/Altera Stratix V documentation and global manufacturing support, this device is positioned for long-lived deployments where density, memory, and I/O count are primary selection criteria.
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