5SGXMA4K1F35I2WN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 37888000 420000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 109 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 600 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 158500 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 37888000 |
Overview of 5SGXMA4K1F35I2WN – Stratix V GX FPGA IC, 420,000 Logic Elements, 600 I/Os
The 5SGXMA4K1F35I2WN is a Stratix® V GX field programmable gate array (FPGA) in a 1152-ball FCBGA package. It delivers high logic capacity, abundant I/O, and on-chip memory suitable for industrial-grade designs.
As a member of the Stratix V GX family, this device targets designs that require large programmable logic resources, significant embedded RAM, and the Stratiy V GX device-class transceiver capabilities noted in the family datasheet.
Key Features
- Core Logic Density 420,000 logic elements providing substantial programmable logic for complex digital designs.
- Logic Structure Approximately 158,500 logic array elements reported for the device family, supporting large-scale logic integration.
- Embedded Memory Approximately 38 Mbits of embedded RAM to support buffering, state storage, and on-chip data processing.
- I/O Count 600 user I/Os to accommodate wide parallel buses, multiple interfaces, and board-level connectivity.
- Power and Core Voltage Core voltage range specified at 870 mV to 930 mV for regulated core-power design and power budgeting.
- Package & Mounting 1152-BBGA FCBGA (1152-FBGA, 35×35) surface-mount package for high-density system integration.
- Industrial Temperature Grade Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
- Standards & Compliance RoHS-compliant material status for environmental and assembly requirements.
Typical Applications
- High-speed communications and networking — Large logic capacity and the Stratix V GX family transceiver capability support packet processing, line cards, and protocol bridging.
- Signal processing and video — Significant embedded RAM and logic resources for real-time processing, buffering, and format conversion.
- Industrial control and automation — Industrial temperature grade and extensive I/O make the device suitable for control systems, motion control, and industrial connectivity.
Unique Advantages
- High logic density: 420,000 logic elements enable consolidation of complex functions into a single device, reducing board-level component count.
- Large on-chip memory: Approximately 38 Mbits of embedded RAM supports large buffers and data-path acceleration without heavy external memory reliance.
- Extensive I/O resources: 600 user I/Os provide flexibility for parallel interfaces, external peripherals, and system expansion.
- Industrial-grade operation: –40 °C to 100 °C operating range allows deployment in demanding environmental conditions.
- Compact, high-density packaging: 1152-ball FCBGA (35×35) package supports compact board layouts while maintaining routing density.
- Controlled core power: Defined core supply range (870–930 mV) facilitates predictable power sequencing and system power design.
Why Choose 5SGXMA4K1F35I2WN?
The 5SGXMA4K1F35I2WN positions itself as a high-capacity Stratix V GX FPGA option for designers needing substantial on-chip logic, memory, and I/O in an industrial-grade package. Its combination of 420,000 logic elements, approximately 38 Mbits of embedded RAM, and 600 I/Os supports integration of complex signal-processing, networking, and control functions onto a single device.
With defined core-voltage requirements, RoHS compliance, and a wide operating temperature window, this device is suitable for long-term, robust deployments where high integration and predictable electrical characteristics are required.
Request a quote or submit an inquiry for pricing and availability of the 5SGXMA4K1F35I2WN to move your design into production readiness.

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