5SGXMA4K1F35C2N

The 5SGXMA4K1F35C2N is a Stratix V GX field-programmable gate array (FPGA) in a 1152-ball FCBGA package intended for commercial-temperature applications. It integrates high-density programmable logic, substantial on-chip memory, and a large I/O count to support complex, I/O‑intensive designs.

Designed for applications that require dense logic capacity and extensive connectivity, this device combines 420,000 logic elements with approximately 38 Mbits of embedded memory and up to 600 I/O pins, delivering a platform for compute, signal processing, and communications-centric implementations.

Key Features

• Core Logic — 420,000 logic elements for implementing large-scale custom logic and complex datapaths.
• Embedded Memory — Approximately 38 Mbits of on-chip RAM to store buffers, FIFOs, and intermediate data close to logic for reduced latency.
• I/O Density — Up to 600 I/O pins to support extensive peripheral and board-level interconnect requirements.
• Transceiver Capability (Series-Level) — Stratix V GX family devices include GX transceiver options, with channel offerings up to 14.1 Gbps per channel as provided in the Stratix V device documentation.
• Power Supply — Core supply range of 870 mV to 930 mV to match system power-rail designs.
• Package & Mounting — 1152-FBGA (35×35) FCBGA package, surface-mount mounting for high-density board assembly.
• Temperature & Grade — Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance — RoHS compliant for environmentally conscious designs.

Typical Applications

• High‑speed networking — Use the device’s large logic capacity and high I/O count for packet processing, switching fabrics, and protocol offload implementations.
• Data plane acceleration — Implement inline data-path functions and hardware accelerators that require substantial logic and on-chip RAM.
• Signal processing — Leverage embedded memory and dense logic for real-time DSP, filtering, and aggregation tasks.
• Test & measurement systems — Combine abundant I/O and logic to handle multi-channel acquisition, preprocessing, and control tasks on a single device.

Unique Advantages

• High logic density: 420,000 logic elements enable consolidation of multiple functions and reduce the need for multiple discrete devices.
• Significant on‑chip RAM: Approximately 38 Mbits of embedded memory helps keep data local to the logic, improving throughput and lowering system latency.
• Extensive I/O capability: Up to 600 I/O pins give flexibility for complex board-level connectivity and multi-protocol interfacing.
• Commercial temperature operation: Rated for 0 °C to 85 °C, suitable for a wide range of controlled-environment electronics.
• RoHS compliant: Aligns with environmental and manufacturing requirements for lead‑free assembly.
• Compact, assembly‑ready package: 1152-FBGA (35×35) FCBGA surface-mount package supports high-density PCB designs and automated assembly.

Why Choose 5SGXMA4K1F35C2N?

The 5SGXMA4K1F35C2N positions itself as a high‑density, high‑I/O FPGA option within the Stratix V GX family for commercial-temperature applications. Its combination of 420,000 logic elements, substantial embedded memory, and up to 600 I/O pins makes it suitable for designs that demand integrated logic capacity, local storage, and broad connectivity without partitioning functionality across multiple devices.

This device is a fit for engineering teams building compute- and I/O-centric systems who require a robust FPGA platform with documented Stratix V family characteristics and commercial-grade operating parameters. Its FCBGA package and RoHS compliance support modern PCB assembly and environmental requirements while enabling complex system integration.

Request a quote or submit a purchase inquiry to receive pricing, availability, and ordering information for the 5SGXMA4K1F35C2N.